Intel Atom Z3590 vs Intel Core 2 Duo T5550

Comparative analysis of Intel Atom Z3590 and Intel Core 2 Duo T5550 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Atom Z3590

Intel Core 2 Duo T5550

Differences

Reasons to consider the Intel Atom Z3590

2 more cores, run more applications at once: 4 vs 2
2 more threads: 4 vs 2
Around 37% higher clock speed: 2.50 GHz vs 1.83 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm

Number of cores	4 vs 2
Number of threads	4 vs 2
Maximum frequency	2.50 GHz vs 1.83 GHz
Manufacturing process technology	22 nm vs 65 nm

Reasons to consider the Intel Core 2 Duo T5550

Around 11% higher maximum core temperature: 100°C vs 90°C

Maximum core temperature	100°C vs 90°C

Compare benchmarks

CPU 1: Intel Atom Z3590
CPU 2: Intel Core 2 Duo T5550

Name	Intel Atom Z3590	Intel Core 2 Duo T5550
PassMark - Single thread mark		681
PassMark - CPU mark		638
Geekbench 4 - Single Core		243
Geekbench 4 - Multi-Core		411

Compare specifications (specs)

	Intel Atom Z3590	Intel Core 2 Duo T5550
Essentials
Architecture codename	Moorefield	Merom
Launch date	Q3'15	1 January 2008
Place in performance rating	not rated	3048
Processor Number	Z3590	T5550
Series	Intel® Atom™ Processor Z Series	Legacy Intel® Core™ Processors
Status	Launched	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Manufacturing process technology	22 nm	65 nm
Maximum core temperature	90°C	100°C
Maximum frequency	2.50 GHz	1.83 GHz
Number of cores	4	2
Number of threads	4	2
VID voltage range	AVID	1.075V-1.250V
Base frequency		1.83 GHz
Bus Speed		667 MHz FSB
Die size		143 mm2
Front-side bus (FSB)		667 MHz
L2 cache		2048 KB
Transistor count		291 million
Memory
Max memory channels	2
Maximum memory bandwidth	12.8 GB/s
Maximum memory size	4 GB
Supported memory types	LPDDR3 1600
Graphics
Graphics base frequency	457 MHz
Graphics max frequency	640 MHz
Graphics interfaces
MIPI-DSI
Number of displays supported	2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	14x14mm	35mm x 35mm
Sockets supported		PPGA478
Thermal Design Power (TDP)		35 Watt
Peripherals
Number of USB ports	2
UART
USB revision	2.0/3.0
Security & Reliability
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
General-Purpose Input/Output (GPIO)
Idle States
Instruction set extensions	Intel® SSE2, Intel® SSE3, Intel® SSSE3, Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Physical Address Extensions (PAE)	32-bit
Smart Idle
Thermal Monitoring
FSB parity
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)