Intel Atom Z560 vs Intel Celeron M U3400
Comparative analysis of Intel Atom Z560 and Intel Celeron M U3400 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Atom Z560
- Around 101% higher clock speed: 2.13 GHz vs 1.06 GHz
- 6x lower typical power consumption: 2.5 Watt vs 18 Watt
| Maximum frequency | 2.13 GHz vs 1.06 GHz |
| Thermal Design Power (TDP) | 2.5 Watt vs 18 Watt |
Reasons to consider the Intel Celeron M U3400
- 1 more cores, run more applications at once: 2 vs 1
- Around 17% higher maximum core temperature: 105°C vs 90°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
| Number of cores | 2 vs 1 |
| Maximum core temperature | 105°C vs 90°C |
| Manufacturing process technology | 32 nm vs 45 nm |
Compare benchmarks
CPU 1: Intel Atom Z560
CPU 2: Intel Celeron M U3400
| Name | Intel Atom Z560 | Intel Celeron M U3400 |
|---|---|---|
| PassMark - Single thread mark | 456 | |
| PassMark - CPU mark | 516 | |
| Geekbench 4 - Single Core | 161 | |
| Geekbench 4 - Multi-Core | 307 |
Compare specifications (specs)
| Intel Atom Z560 | Intel Celeron M U3400 | |
|---|---|---|
Essentials |
||
| Architecture codename | Silverthorne | Arrandale |
| Launch date | June 2010 | 24 May 2010 |
| Place in performance rating | not rated | 3228 |
| Processor Number | Z560 | U3400 |
| Series | Legacy Intel Atom® Processors | Legacy Intel® Celeron® Processor |
| Status | Discontinued | Discontinued |
| Vertical segment | Mobile | Mobile |
Performance |
||
| Base frequency | 2.13 GHz | 1.06 GHz |
| Bus Speed | 533 MHz FSB | 2.5 GT/s DMI |
| Die size | 26 mm2 | 81 mm2 |
| L1 cache | 64 KB (per core) | |
| L2 cache | 512 KB (per core) | 512 KB |
| Manufacturing process technology | 45 nm | 32 nm |
| Maximum core temperature | 90°C | 105°C |
| Maximum frequency | 2.13 GHz | 1.06 GHz |
| Number of cores | 1 | 2 |
| Transistor count | 47 million | 382 million |
| VID voltage range | 0.75V-1.1V | |
| 64 bit support | ||
| Front-side bus (FSB) | 2500 MHz | |
| L3 cache | 2048 KB | |
| Number of threads | 2 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 13mm x 14mm | BGA 34mm x 28mm |
| Sockets supported | PBGA441 | BGA1288 |
| Thermal Design Power (TDP) | 2.5 Watt | 18 Watt |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 12.8 GB/s | |
| Maximum memory size | 8 GB | |
| Supported memory types | DDR3 800 | |
Graphics |
||
| Graphics base frequency | 166 MHz | |
| Graphics max dynamic frequency | 500 MHz | |
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
||
| Number of displays supported | 2 | |
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16 | |