Intel Atom x6214RE vs Intel Core 2 Duo T5300
Comparative analysis of Intel Atom x6214RE and Intel Core 2 Duo T5300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Atom x6214RE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 65 nm
- 5.7x lower typical power consumption: 6 Watt vs 34 Watt
- Around 41% better performance in PassMark - Single thread mark: 754 vs 533
- 2.1x better performance in PassMark - CPU mark: 1109 vs 530
| Specifications (specs) | |
| Manufacturing process technology | 10 nm vs 65 nm |
| Thermal Design Power (TDP) | 6 Watt vs 34 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 754 vs 533 |
| PassMark - CPU mark | 1109 vs 530 |
Reasons to consider the Intel Core 2 Duo T5300
- Around 18% higher maximum core temperature: 100°C vs 85 °C
| Maximum core temperature | 100°C vs 85 °C |
Compare benchmarks
CPU 1: Intel Atom x6214RE
CPU 2: Intel Core 2 Duo T5300
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Atom x6214RE | Intel Core 2 Duo T5300 |
|---|---|---|
| PassMark - Single thread mark | 754 | 533 |
| PassMark - CPU mark | 1109 | 530 |
| Geekbench 4 - Single Core | 918 | |
| Geekbench 4 - Multi-Core | 1412 |
Compare specifications (specs)
| Intel Atom x6214RE | Intel Core 2 Duo T5300 | |
|---|---|---|
Essentials |
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| Launch date | Q1'23 | |
| Launch price (MSRP) | $47 | |
| Place in performance rating | 2607 | 2608 |
| Processor Number | X6214RE | T5300 |
| Architecture codename | Merom | |
| Series | Legacy Intel® Core™ Processors | |
| Status | Discontinued | |
| Vertical segment | Mobile | |
Performance |
||
| Base frequency | 1.40 GHz | 1.73 GHz |
| L2 cache | 1.5 MB | |
| Manufacturing process technology | 10 nm | 65 nm |
| Maximum core temperature | 85 °C | 100°C |
| Number of cores | 2 | 2 |
| Number of threads | 2 | |
| 64 bit support | ||
| Bus Speed | 533 MHz FSB | |
| Die size | 143 mm2 | |
| Transistor count | 291 million | |
Memory |
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| ECC memory support | ||
| Max memory channels | 4 | |
| Maximum memory bandwidth | 51.2 GB/s | |
| Maximum memory size | 32 GB | |
| Supported memory types | 4x32 LPDDR4/x 3200MT/s Max 16GB / 2x64 DDR4 3200MT/s Max 32GB LPDDR4/x & DDR4 with In-Band ECC | |
Graphics |
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| Execution Units | 16 | |
| Graphics base frequency | 400 MHz | |
| Processor graphics | Intel UHD Graphics for 10th Gen Intel Processors | |
Compatibility |
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| Max number of CPUs in a configuration | 1 | |
| Sockets supported | FCBGA1493 | PPGA478 |
| Thermal Design Power (TDP) | 6 Watt | 34 Watt |
| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | |
Peripherals |
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| Max number of PCIe lanes | 8 | |
| PCI Express revision | 3.0 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
