Intel Celeron 220 vs Intel Pentium III 800

Comparative analysis of Intel Celeron 220 and Intel Pentium III 800 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron 220

Intel Pentium III 800

Differences

Reasons to consider the Intel Celeron 220

Around 50% higher clock speed: 1.2 GHz vs 0.8 GHz
Around 25% higher maximum core temperature: 100°C vs 80°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 180 nm
8x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 11% lower typical power consumption: 19 Watt vs 20.8 Watt
Around 8% better performance in PassMark - Single thread mark: 255 vs 237
Around 15% better performance in PassMark - CPU mark: 209 vs 182

Specifications (specs)
Maximum frequency	1.2 GHz vs 0.8 GHz
Maximum core temperature	100°C vs 80°C
Manufacturing process technology	65 nm vs 180 nm
L1 cache	64 KB vs 8 KB
L2 cache	512 KB vs 256 KB
Thermal Design Power (TDP)	19 Watt vs 20.8 Watt
Benchmarks
PassMark - Single thread mark	255 vs 237
PassMark - CPU mark	209 vs 182

Compare benchmarks

CPU 1: Intel Celeron 220
CPU 2: Intel Pentium III 800

PassMark - Single thread mark

CPU 1

CPU 2

255

237

PassMark - CPU mark

CPU 1

CPU 2

209

182

Name	Intel Celeron 220	Intel Pentium III 800
PassMark - Single thread mark	255	237
PassMark - CPU mark	209	182

Compare specifications (specs)

	Intel Celeron 220	Intel Pentium III 800
Essentials
Architecture codename	Conroe	Coppermine T
Launch date	October 2007	n/d
Place in performance rating	3267	3273
Processor Number	220
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	1.20 GHz	800 MHz
Bus Speed	533 MHz FSB	133 MHz FSB
Die size	77 mm2	80 mm
Front-side bus (FSB)	533 MHz
L1 cache	64 KB	8 KB
L2 cache	512 KB	256 KB
Manufacturing process technology	65 nm	180 nm
Maximum core temperature	100°C	80°C
Maximum frequency	1.2 GHz	0.8 GHz
Number of cores	1	1
Number of threads	1
Transistor count	105 million	44 million
VID voltage range	1.0000V-1.3375V	1.75V
Maximum case temperature (TCase)		69 °C
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	35mm x 35mm
Sockets supported	PBGA479	PPGA370, SECC2, SECC2495
Thermal Design Power (TDP)	19 Watt	20.8 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)