Intel Celeron 807UE vs Intel Celeron Dual-Core T3000
Comparative analysis of Intel Celeron 807UE and Intel Celeron Dual-Core T3000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron 807UE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 3.5x lower typical power consumption: 10 Watt vs 35 Watt
Manufacturing process technology | 32 nm vs 45 nm |
Thermal Design Power (TDP) | 10 Watt vs 35 Watt |
Reasons to consider the Intel Celeron Dual-Core T3000
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- Around 73% better performance in PassMark - Single thread mark: 728 vs 421
- 4.5x better performance in PassMark - CPU mark: 1084 vs 241
Specifications (specs) | |
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
Benchmarks | |
PassMark - Single thread mark | 728 vs 421 |
PassMark - CPU mark | 1084 vs 241 |
Compare benchmarks
CPU 1: Intel Celeron 807UE
CPU 2: Intel Celeron Dual-Core T3000
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron 807UE | Intel Celeron Dual-Core T3000 |
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PassMark - Single thread mark | 421 | 728 |
PassMark - CPU mark | 241 | 1084 |
Geekbench 4 - Single Core | 219 | |
Geekbench 4 - Multi-Core | 377 |
Compare specifications (specs)
Intel Celeron 807UE | Intel Celeron Dual-Core T3000 | |
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Essentials |
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Architecture codename | Sandy Bridge | Penryn-1M |
Launch date | Q4'11 | 1 May 2009 |
Place in performance rating | 3108 | 3007 |
Processor Number | 807UE | |
Series | Legacy Intel® Celeron® Processor | Intel Celeron Dual-Core |
Status | Launched | |
Vertical segment | Embedded | Laptop |
Performance |
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64 bit support | ||
Base frequency | 1.00 GHz | |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 100°C | |
Number of cores | 1 | 2 |
Number of threads | 1 | 2 |
Die size | 107 mm | |
Front-side bus (FSB) | 800 MHz | |
L1 cache | 64 KB | |
L2 cache | 1024 KB | |
Maximum frequency | 1.8 GHz | |
Transistor count | 410 Million | |
Memory |
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Max memory channels | 1 | |
Maximum memory size | 4.88 GB | |
Supported memory types | DDR3 1066/1333 | |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 800 MHz | |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 31mm x 24mm (FCBGA1023) | |
Sockets supported | FCBGA1023 | P (478) |
Thermal Design Power (TDP) | 10 Watt | 35 Watt |
Security & Reliability |
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Anti-Theft technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |