Intel Celeron 807UE vs Intel Celeron Dual-Core T3000

Comparative analysis of Intel Celeron 807UE and Intel Celeron Dual-Core T3000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron 807UE

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • 3.5x lower typical power consumption: 10 Watt vs 35 Watt
Manufacturing process technology 32 nm vs 45 nm
Thermal Design Power (TDP) 10 Watt vs 35 Watt

Reasons to consider the Intel Celeron Dual-Core T3000

  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • Around 73% better performance in PassMark - Single thread mark: 728 vs 421
  • 4.5x better performance in PassMark - CPU mark: 1084 vs 241
Specifications (specs)
Number of cores 2 vs 1
Number of threads 2 vs 1
Benchmarks
PassMark - Single thread mark 728 vs 421
PassMark - CPU mark 1084 vs 241

Compare benchmarks

CPU 1: Intel Celeron 807UE
CPU 2: Intel Celeron Dual-Core T3000

PassMark - Single thread mark
CPU 1
CPU 2
421
728
PassMark - CPU mark
CPU 1
CPU 2
241
1084
Name Intel Celeron 807UE Intel Celeron Dual-Core T3000
PassMark - Single thread mark 421 728
PassMark - CPU mark 241 1084
Geekbench 4 - Single Core 219
Geekbench 4 - Multi-Core 377

Compare specifications (specs)

Intel Celeron 807UE Intel Celeron Dual-Core T3000

Essentials

Architecture codename Sandy Bridge Penryn-1M
Launch date Q4'11 1 May 2009
Place in performance rating 3108 3007
Processor Number 807UE
Series Legacy Intel® Celeron® Processor Intel Celeron Dual-Core
Status Launched
Vertical segment Embedded Laptop

Performance

64 bit support
Base frequency 1.00 GHz
Manufacturing process technology 32 nm 45 nm
Maximum core temperature 100°C
Number of cores 1 2
Number of threads 1 2
Die size 107 mm
Front-side bus (FSB) 800 MHz
L1 cache 64 KB
L2 cache 1024 KB
Maximum frequency 1.8 GHz
Transistor count 410 Million

Memory

Max memory channels 1
Maximum memory size 4.88 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 800 MHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Compatibility

Low Halogen Options Available
Package Size 31mm x 24mm (FCBGA1023)
Sockets supported FCBGA1023 P (478)
Thermal Design Power (TDP) 10 Watt 35 Watt

Security & Reliability

Anti-Theft technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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