Intel Celeron 807UE vs Intel Celeron Dual-Core T3000

Comparative analysis of Intel Celeron 807UE and Intel Celeron Dual-Core T3000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Celeron 807UE

Intel Celeron Dual-Core T3000

Differences

Reasons to consider the Intel Celeron 807UE

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
3.5x lower typical power consumption: 10 Watt vs 35 Watt

Manufacturing process technology	32 nm vs 45 nm
Thermal Design Power (TDP)	10 Watt vs 35 Watt

Reasons to consider the Intel Celeron Dual-Core T3000

1 more cores, run more applications at once: 2 vs 1
1 more threads: 2 vs 1
Around 73% better performance in PassMark - Single thread mark: 728 vs 421
4.5x better performance in PassMark - CPU mark: 1084 vs 241

Specifications (specs)
Number of cores	2 vs 1
Number of threads	2 vs 1
Benchmarks
PassMark - Single thread mark	728 vs 421
PassMark - CPU mark	1084 vs 241

Compare benchmarks

CPU 1: Intel Celeron 807UE
CPU 2: Intel Celeron Dual-Core T3000

PassMark - Single thread mark

CPU 1

CPU 2

421

728

PassMark - CPU mark

CPU 1

CPU 2

241

1084

Name	Intel Celeron 807UE	Intel Celeron Dual-Core T3000
PassMark - Single thread mark	421	728
PassMark - CPU mark	241	1084
Geekbench 4 - Single Core		219
Geekbench 4 - Multi-Core		377

Compare specifications (specs)

	Intel Celeron 807UE	Intel Celeron Dual-Core T3000
Essentials
Architecture codename	Sandy Bridge	Penryn-1M
Launch date	Q4'11	1 May 2009
Place in performance rating	3109	3007
Processor Number	807UE
Series	Legacy Intel® Celeron® Processor	Intel Celeron Dual-Core
Status	Launched
Vertical segment	Embedded	Laptop
Performance
64 bit support
Base frequency	1.00 GHz
Manufacturing process technology	32 nm	45 nm
Maximum core temperature	100°C
Number of cores	1	2
Number of threads	1	2
Die size		107 mm
Front-side bus (FSB)		800 MHz
L1 cache		64 KB
L2 cache		1024 KB
Maximum frequency		1.8 GHz
Transistor count		410 Million
Memory
Max memory channels	1
Maximum memory size	4.88 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	350 MHz
Graphics max dynamic frequency	800 MHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)
Sockets supported	FCBGA1023	P (478)
Thermal Design Power (TDP)	10 Watt	35 Watt
Security & Reliability
Anti-Theft technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)