Intel Celeron 887 vs Intel Core Duo T2050
Comparative analysis of Intel Celeron 887 and Intel Core Duo T2050 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron 887
- CPU is newer: launch date 7 year(s) 5 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 82% lower typical power consumption: 17 Watt vs 31 Watt
- Around 41% better performance in PassMark - Single thread mark: 703 vs 498
- 2.3x better performance in PassMark - CPU mark: 754 vs 333
Specifications (specs) | |
Launch date | 1 October 2012 vs May 2005 |
Manufacturing process technology | 32 nm vs 65 nm |
Thermal Design Power (TDP) | 17 Watt vs 31 Watt |
Benchmarks | |
PassMark - Single thread mark | 703 vs 498 |
PassMark - CPU mark | 754 vs 333 |
Reasons to consider the Intel Core Duo T2050
- Around 7% higher clock speed: 1.6 GHz vs 1.5 GHz
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 1.6 GHz vs 1.5 GHz |
L2 cache | 2048 KB vs 512 KB |
Compare benchmarks
CPU 1: Intel Celeron 887
CPU 2: Intel Core Duo T2050
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron 887 | Intel Core Duo T2050 |
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PassMark - Single thread mark | 703 | 498 |
PassMark - CPU mark | 754 | 333 |
Geekbench 4 - Single Core | 224 | |
Geekbench 4 - Multi-Core | 410 |
Compare specifications (specs)
Intel Celeron 887 | Intel Core Duo T2050 | |
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Essentials |
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Architecture codename | Sandy Bridge | Yonah |
Launch date | 1 October 2012 | May 2005 |
Launch price (MSRP) | $86 | |
Place in performance rating | 3019 | 3013 |
Processor Number | 887 | T2050 |
Series | Legacy Intel® Celeron® Processor | Legacy Intel® Core™ Processors |
Status | Launched | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 1.50 GHz | 1.60 GHz |
Bus Speed | 5 GT/s DMI | 533 MHz FSB |
Die size | 131 mm | 90 mm2 |
L1 cache | 128 KB | |
L2 cache | 512 KB | 2048 KB |
L3 cache | 2048 KB | |
Manufacturing process technology | 32 nm | 65 nm |
Maximum core temperature | 100 °C | 100°C |
Maximum frequency | 1.5 GHz | 1.6 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Transistor count | 504 million | 151 million |
Front-side bus (FSB) | 533 MHz | |
VID voltage range | 0.7625-1.3V | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3 1066/1333 | DDR1 |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 31.0mm x 24.0mm (BGA1023) | 35mm x 35mm |
Sockets supported | FCBGA1023 | PPGA478 |
Thermal Design Power (TDP) | 17 Watt | 31 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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4G WiMAX Wireless | ||
Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Physical Address Extensions (PAE) | 32-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |