Intel Celeron B710 vs Intel Atom Z530

Comparative analysis of Intel Celeron B710 and Intel Atom Z530 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron B710

Intel Atom Z530

Differences

Reasons to consider the Intel Celeron B710

CPU is newer: launch date 2 year(s) 11 month(s) later
Around 11% higher maximum core temperature: 100C vs 90°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm

Launch date	15 March 2011 vs April 2008
Maximum core temperature	100C vs 90°C
Manufacturing process technology	32 nm vs 45 nm

Reasons to consider the Intel Atom Z530

2x more L2 cache, more data can be stored in the L2 cache for quick access later
17.5x lower typical power consumption: 2 Watt vs 35 Watt
Around 59% better performance in PassMark - Single thread mark: 161 vs 101
Around 73% better performance in PassMark - CPU mark: 183 vs 106

Specifications (specs)
L2 cache	512 KB (per core) vs 256 KB
Thermal Design Power (TDP)	2 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark	161 vs 101
PassMark - CPU mark	183 vs 106

Compare benchmarks

CPU 1: Intel Celeron B710
CPU 2: Intel Atom Z530

PassMark - Single thread mark

CPU 1

CPU 2

101

161

PassMark - CPU mark

CPU 1

CPU 2

106

183

Name	Intel Celeron B710	Intel Atom Z530
PassMark - Single thread mark	101	161
PassMark - CPU mark	106	183

Compare specifications (specs)

	Intel Celeron B710	Intel Atom Z530
Essentials
Architecture codename	Sandy Bridge	Silverthorne
Launch date	15 March 2011	April 2008
Place in performance rating	3313	3303
Processor Number	B710	Z530
Series	Legacy Intel® Celeron® Processor	Legacy Intel Atom® Processors
Status	Launched	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.60 GHz	1.60 GHz
Die size	131 mm	26 mm2
L1 cache	64 KB	64 KB (per core)
L2 cache	256 KB	512 KB (per core)
L3 cache	1536 KB
Manufacturing process technology	32 nm	45 nm
Maximum core temperature	100C	90°C
Maximum frequency	1.6 GHz	1.6 GHz
Number of cores	1	1
Number of threads	1
Transistor count	504 million	47 million
Bus Speed		533 MHz FSB
VID voltage range		0.75 -1.1V
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.00 GHz
Graphics max frequency	1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mmx37.5mm (rPGA988B)	13mm x 14mm
Sockets supported	PGA988	PBGA441
Thermal Design Power (TDP)	35 Watt	2 Watt
Scenario Design Power (SDP)		0.96 W
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	Intel® SSE2, Intel® SSE3, Intel® SSSE3
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)