Intel Celeron B710 vs Intel Atom Z530

Comparative analysis of Intel Celeron B710 and Intel Atom Z530 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Celeron B710

  • CPU is newer: launch date 2 year(s) 11 month(s) later
  • Around 11% higher maximum core temperature: 100C vs 90°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
Launch date 15 March 2011 vs April 2008
Maximum core temperature 100C vs 90°C
Manufacturing process technology 32 nm vs 45 nm

Reasons to consider the Intel Atom Z530

  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 17.5x lower typical power consumption: 2 Watt vs 35 Watt
  • Around 59% better performance in PassMark - Single thread mark: 161 vs 101
  • Around 73% better performance in PassMark - CPU mark: 183 vs 106
Specifications (specs)
L2 cache 512 KB (per core) vs 256 KB
Thermal Design Power (TDP) 2 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark 161 vs 101
PassMark - CPU mark 183 vs 106

Compare benchmarks

CPU 1: Intel Celeron B710
CPU 2: Intel Atom Z530

PassMark - Single thread mark
CPU 1
CPU 2
101
161
PassMark - CPU mark
CPU 1
CPU 2
106
183
Name Intel Celeron B710 Intel Atom Z530
PassMark - Single thread mark 101 161
PassMark - CPU mark 106 183

Compare specifications (specs)

Intel Celeron B710 Intel Atom Z530

Essentials

Architecture codename Sandy Bridge Silverthorne
Launch date 15 March 2011 April 2008
Place in performance rating 3313 3303
Processor Number B710 Z530
Series Legacy Intel® Celeron® Processor Legacy Intel Atom® Processors
Status Launched Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 1.60 GHz 1.60 GHz
Die size 131 mm 26 mm2
L1 cache 64 KB 64 KB (per core)
L2 cache 256 KB 512 KB (per core)
L3 cache 1536 KB
Manufacturing process technology 32 nm 45 nm
Maximum core temperature 100C 90°C
Maximum frequency 1.6 GHz 1.6 GHz
Number of cores 1 1
Number of threads 1
Transistor count 504 million 47 million
Bus Speed 533 MHz FSB
VID voltage range 0.75 -1.1V

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.00 GHz
Graphics max frequency 1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mmx37.5mm (rPGA988B) 13mm x 14mm
Sockets supported PGA988 PBGA441
Thermal Design Power (TDP) 35 Watt 2 Watt
Scenario Design Power (SDP) 0.96 W

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2 Intel® SSE2, Intel® SSE3, Intel® SSSE3
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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