Intel Celeron B810E vs Intel Celeron G470

Comparative analysis of Intel Celeron B810E and Intel Celeron G470 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Celeron B810E

Intel Celeron G470

Differences

Reasons to consider the Intel Celeron B810E

1 more cores, run more applications at once: 2 vs 1
Around 53% higher maximum core temperature: 100 vs 65.5°C

Number of cores	2 vs 1
Maximum core temperature	100 vs 65.5°C

Reasons to consider the Intel Celeron G470

Around 93% higher maximum memory size: 32 GB vs 16.6 GB

Maximum memory size	32 GB vs 16.6 GB

Compare benchmarks

CPU 1: Intel Celeron B810E
CPU 2: Intel Celeron G470

Name	Intel Celeron B810E	Intel Celeron G470
PassMark - Single thread mark		844
PassMark - CPU mark		568

Compare specifications (specs)

	Intel Celeron B810E	Intel Celeron G470
Essentials
Architecture codename	Sandy Bridge	Sandy Bridge
Launch date	Q2'11	Q2'13
Place in performance rating	not rated	2406
Processor Number	B810E	G470
Series	Legacy Intel® Celeron® Processor	Legacy Intel® Celeron® Processor
Status	Launched	Launched
Vertical segment	Embedded	Desktop
Performance
64 bit support
Base frequency	1.60 GHz	2.00 GHz
Manufacturing process technology	32 nm	32 nm
Maximum core temperature	100	65.5°C
Number of cores	2	1
Number of threads	2	2
Bus Speed		5 GT/s DMI
Memory
Max memory channels	2	2
Maximum memory bandwidth	21.3 GB/s	17 GB/s
Maximum memory size	16.6 GB	32 GB
Supported memory types	DDR3 1066/1333	DDR3 1066/1333
Graphics
Graphics base frequency	650 MHz	650 MHz
Graphics max dynamic frequency	1.00 GHz	1.00 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel HD Graphics	Intel HD Graphics
Intel® Flexible Display Interface (Intel® FDI)
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2	2
SDVO
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)	37.5mm x 37.5mm
Sockets supported	FCBGA1023	FCLGA1155
Thermal Design Power (TDP)	35 Watt	35 Watt
Max number of CPUs in a configuration		1
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Intel® Trusted Execution technology (TXT)
Execute Disable Bit (EDB)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel® Optane™ Memory Supported
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)