Intel Celeron B830 vs Intel Core 2 Duo T6670

Comparative analysis of Intel Celeron B830 and Intel Core 2 Duo T6670 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron B830

  • CPU is newer: launch date 3 year(s) 8 month(s) later
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • Around 4% better performance in PassMark - CPU mark: 863 vs 827
  • Around 15% better performance in Geekbench 4 - Single Core: 323 vs 281
  • Around 20% better performance in Geekbench 4 - Multi-Core: 595 vs 494
Specifications (specs)
Launch date 2 September 2012 vs 1 January 2009
Manufacturing process technology 32 nm vs 45 nm
Benchmarks
PassMark - CPU mark 863 vs 827
Geekbench 4 - Single Core 323 vs 281
Geekbench 4 - Multi-Core 595 vs 494

Reasons to consider the Intel Core 2 Duo T6670

  • Around 22% higher clock speed: 2.2 GHz vs 1.8 GHz
  • Around 5% higher maximum core temperature: 105°C vs 100 °C
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 8% better performance in PassMark - Single thread mark: 886 vs 823
Specifications (specs)
Maximum frequency 2.2 GHz vs 1.8 GHz
Maximum core temperature 105°C vs 100 °C
L2 cache 2048 KB vs 256 KB (per core)
Benchmarks
PassMark - Single thread mark 886 vs 823

Compare benchmarks

CPU 1: Intel Celeron B830
CPU 2: Intel Core 2 Duo T6670

PassMark - Single thread mark
CPU 1
CPU 2
823
886
PassMark - CPU mark
CPU 1
CPU 2
863
827
Geekbench 4 - Single Core
CPU 1
CPU 2
323
281
Geekbench 4 - Multi-Core
CPU 1
CPU 2
595
494
Name Intel Celeron B830 Intel Core 2 Duo T6670
PassMark - Single thread mark 823 886
PassMark - CPU mark 863 827
Geekbench 4 - Single Core 323 281
Geekbench 4 - Multi-Core 595 494

Compare specifications (specs)

Intel Celeron B830 Intel Core 2 Duo T6670

Essentials

Architecture codename Sandy Bridge Penryn
Launch date 2 September 2012 1 January 2009
Launch price (MSRP) $86
Place in performance rating 2830 2833
Processor Number B830 T6670
Series Legacy Intel® Celeron® Processor Legacy Intel® Core™ Processors
Status Launched Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 1.80 GHz 2.20 GHz
Bus Speed 5 GT/s DMI 800 MHz FSB
Die size 131 mm 107 mm2
L1 cache 64 KB (per core)
L2 cache 256 KB (per core) 2048 KB
L3 cache 2048 KB
Manufacturing process technology 32 nm 45 nm
Maximum core temperature 100 °C 105°C
Maximum frequency 1.8 GHz 2.2 GHz
Number of cores 2 2
Number of threads 2 2
Transistor count 504 million 410 million
Front-side bus (FSB) 800 MHz

Memory

Max memory channels 2
Maximum memory bandwidth 21.3 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.05 GHz
Graphics max frequency 1.05 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel HD Graphics

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mmx37.5mm (rPGA988B) 35mm x 35mm
Sockets supported FCPGA988 PGA478
Thermal Design Power (TDP) 35 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)