Intel Celeron G1820TE vs AMD Athlon II N330
Comparative analysis of Intel Celeron G1820TE and AMD Athlon II N330 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Celeron G1820TE
- CPU is newer: launch date 3 year(s) 6 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 20% better performance in PassMark - Single thread mark: 978 vs 813
- Around 53% better performance in PassMark - CPU mark: 1020 vs 665
Specifications (specs) | |
Launch date | December 2013 vs 12 May 2010 |
Manufacturing process technology | 22 nm vs 45 nm |
Benchmarks | |
PassMark - Single thread mark | 978 vs 813 |
PassMark - CPU mark | 1020 vs 665 |
Reasons to consider the AMD Athlon II N330
- Around 5% higher clock speed: 2.3 GHz vs 2.2 GHz
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 2.3 GHz vs 2.2 GHz |
L1 cache | 256 KB vs 64 KB (per core) |
L2 cache | 1024 KB vs 256 KB (per core) |
Compare benchmarks
CPU 1: Intel Celeron G1820TE
CPU 2: AMD Athlon II N330
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron G1820TE | AMD Athlon II N330 |
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PassMark - Single thread mark | 978 | 813 |
PassMark - CPU mark | 1020 | 665 |
3DMark Fire Strike - Physics Score | 882 |
Compare specifications (specs)
Intel Celeron G1820TE | AMD Athlon II N330 | |
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Essentials |
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Architecture codename | Haswell | Champlain |
Launch date | December 2013 | 12 May 2010 |
Place in performance rating | 2604 | 2553 |
Processor Number | G1820TE | |
Series | Intel® Celeron® Processor G Series | AMD Athlon II |
Status | Launched | |
Vertical segment | Embedded | Laptop |
Performance |
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64 bit support | ||
Base frequency | 2.20 GHz | |
Bus Speed | 5 GT/s DMI2 | |
Die size | 177 mm | 117.5 mm |
L1 cache | 64 KB (per core) | 256 KB |
L2 cache | 256 KB (per core) | 1024 KB |
L3 cache | 3072 KB (shared) | |
Manufacturing process technology | 22 nm | 45 nm |
Maximum case temperature (TCase) | 72 °C | |
Maximum frequency | 2.2 GHz | 2.3 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Transistor count | 1400 million | 234 Million |
Front-side bus (FSB) | 3200 MHz | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1333 | |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Graphics max frequency | 1 GHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® Quick Sync Video | ||
Max video memory | 1.7 GB | |
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1150 | S1 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Thermal Solution | PCG 2013A | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | Up to 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8/2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
VirusProtect | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |