Nombre clave de la arquitectura |
Haswell |
Sandy Bridge |
Fecha de lanzamiento |
December 2013 |
February 2011 |
Lugar en calificación por desempeño |
2604 |
2606 |
Processor Number |
G1820TE |
i3-2310E |
Series |
Intel® Celeron® Processor G Series |
Legacy Intel® Core™ Processors |
Status |
Launched |
Launched |
Segmento vertical |
Embedded |
Embedded |
Precio de lanzamiento (MSRP) |
|
$225 |
Precio ahora |
|
$225 |
Valor/costo (0-100) |
|
3.72 |
Soporte de 64 bits |
|
|
Base frequency |
2.20 GHz |
2.10 GHz |
Bus Speed |
5 GT/s DMI2 |
|
Troquel |
177 mm |
149 mm |
Caché L1 |
64 KB (per core) |
64 KB (per core) |
Caché L2 |
256 KB (per core) |
256 KB (per core) |
Caché L3 |
3072 KB (shared) |
3072 KB (shared) |
Tecnología de proceso de manufactura |
22 nm |
32 nm |
Temperatura máxima de la carcasa (TCase) |
72 °C |
|
Frecuencia máxima |
2.2 GHz |
2.1 GHz |
Número de núcleos |
2 |
2 |
Número de subprocesos |
2 |
4 |
Número de transistores |
1400 million |
624 million |
Temperatura máxima del núcleo |
|
100C (BGA) |
Soporte de memoria ECC |
|
|
Canales máximos de memoria |
2 |
2 |
Máximo banda ancha de la memoria |
21.3 GB/s |
21.3 GB/s |
Tamaño máximo de la memoria |
32 GB |
16.6 GB |
Tipos de memorias soportadas |
DDR3 1333 |
DDR3 1066/1333 |
Graphics base frequency |
350 MHz |
650 MHz |
Graphics max dynamic frequency |
1.00 GHz |
1.05 GHz |
Frecuencia gráfica máxima |
1 GHz |
1.05 GHz |
Intel® Flexible Display Interface (Intel® FDI) |
|
|
Intel® Quick Sync Video |
|
|
Memoria de video máxima |
1.7 GB |
|
Procesador gráfico |
Intel HD Graphics |
Intel® HD Graphics 3000 |
Tecnología Intel® Clear Video HD |
|
|
Tecnología Intel® InTru™ 3D |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Número de pantallas soportadas |
3 |
2 |
VGA |
|
|
CRT |
|
|
SDVO |
|
|
Soporte de pantalla inalámbrica (WiDi) |
|
|
Low Halogen Options Available |
|
|
Número máximo de CPUs en la configuración |
1 |
1 |
Package Size |
37.5mm x 37.5mm |
31mm x 24mm (BGA1023) |
Zócalos soportados |
FCLGA1150 |
FCBGA1023 |
Diseño energético térmico (TDP) |
35 Watt |
35 Watt |
Thermal Solution |
PCG 2013A |
|
Número máximo de canales PCIe |
16 |
16 |
Clasificación PCI Express |
Up to 3.0 |
2.0 |
PCIe configurations |
Up to 1x16, 2x8, 1x8/2x4 |
1x16, 2x8, 1x8+2x4 |
Scalability |
1S Only |
|
Execute Disable Bit (EDB) |
|
|
Tecnología Intel® Identity Protection |
|
|
Tecnología Intel® Secure Key |
|
|
Tecnología Intel® Trusted Execution (TXT) |
|
|
Tecnología Anti-Theft |
|
|
Tecnología Enhanced Intel SpeedStep® |
|
|
Flexible Display interface (FDI) |
|
|
Idle States |
|
|
Instruction set extensions |
Intel® SSE4.1, Intel® SSE4.2 |
Intel® AVX |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Tecnología Intel® Hyper-Threading |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Tecnología Intel® Turbo Boost |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
4G WiMAX Wireless |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® Demand Based Switching |
|
|
Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
|
|
Tecnología Intel® My WiFi |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|