Intel Celeron G3900E vs Intel Core i3-2312M
Comparative analysis of Intel Celeron G3900E and Intel Core i3-2312M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron G3900E
- Around 18% higher maximum core temperature: 100°C vs 85 C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- 4x more maximum memory size: 64 GB vs 16 GB
- Around 73% better performance in PassMark - Single thread mark: 1499 vs 866
- Around 73% better performance in PassMark - CPU mark: 2034 vs 1175
Specifications (specs) | |
Maximum core temperature | 100°C vs 85 C |
Manufacturing process technology | 14 nm vs 32 nm |
Maximum memory size | 64 GB vs 16 GB |
Benchmarks | |
PassMark - Single thread mark | 1499 vs 866 |
PassMark - CPU mark | 2034 vs 1175 |
Reasons to consider the Intel Core i3-2312M
- 2 more threads: 4 vs 2
Number of threads | 4 vs 2 |
Compare benchmarks
CPU 1: Intel Celeron G3900E
CPU 2: Intel Core i3-2312M
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron G3900E | Intel Core i3-2312M |
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PassMark - Single thread mark | 1499 | 866 |
PassMark - CPU mark | 2034 | 1175 |
Geekbench 4 - Single Core | 1963 | |
Geekbench 4 - Multi-Core | 3645 |
Compare specifications (specs)
Intel Celeron G3900E | Intel Core i3-2312M | |
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Essentials |
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Architecture codename | Skylake | Sandy Bridge |
Launch date | Q1'16 | 20 February 2011 |
Place in performance rating | 1719 | 1699 |
Processor Number | G3900E | i3-2312M |
Series | Intel® Celeron® Processor G Series | Legacy Intel® Core™ Processors |
Status | Launched | Launched |
Vertical segment | Embedded | Mobile |
Launch price (MSRP) | $225 | |
Performance |
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64 bit support | ||
Base frequency | 2.40 GHz | 2.10 GHz |
Bus Speed | 8 GT/s DMI3 | 5 GT/s DMI |
Manufacturing process technology | 14 nm | 32 nm |
Maximum core temperature | 100°C | 85 C |
Number of cores | 2 | 2 |
Number of threads | 2 | 4 |
Die size | 149 mm | |
L1 cache | 128 KB | |
L2 cache | 512 KB | |
L3 cache | 3072 KB | |
Maximum case temperature (TCase) | 85 °C | |
Maximum frequency | 2.1 GHz | |
Transistor count | 624 Million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 34.1 GB/s | 21.3 GB/s |
Maximum memory size | 64 GB | 16 GB |
Supported memory types | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V | DDR3 1066/1333 |
Graphics |
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Device ID | 0x1902 | 0x116 |
Graphics base frequency | 350 MHz | 650 MHz |
Graphics max dynamic frequency | 950 MHz | 1.10 GHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | |
Processor graphics | Intel® HD Graphics 510 | Intel® HD Graphics 3000 |
Graphics max frequency | 1.1 GHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
CRT | ||
SDVO | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.4 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 42mm x 28mm | 37.5mm x 37.5mm *rPGA988B); |
Sockets supported | FCBGA1440 | PPGA988 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x16, 2x8, 1x8+2x4 |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Anti-Theft technology | ||
Intel® Identity Protection technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | Intel® AVX |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
4G WiMAX Wireless | ||
Flexible Display interface (FDI) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® My WiFi technology | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |