Intel Celeron G3900E vs Intel Core i3-2312M

Comparative analysis of Intel Celeron G3900E and Intel Core i3-2312M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Celeron G3900E

  • Around 18% higher maximum core temperature: 100°C vs 85 C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
  • 4x more maximum memory size: 64 GB vs 16 GB
  • Around 73% better performance in PassMark - Single thread mark: 1499 vs 866
  • Around 73% better performance in PassMark - CPU mark: 2034 vs 1175
Specifications (specs)
Maximum core temperature 100°C vs 85 C
Manufacturing process technology 14 nm vs 32 nm
Maximum memory size 64 GB vs 16 GB
Benchmarks
PassMark - Single thread mark 1499 vs 866
PassMark - CPU mark 2034 vs 1175

Reasons to consider the Intel Core i3-2312M

  • 2 more threads: 4 vs 2
Number of threads 4 vs 2

Compare benchmarks

CPU 1: Intel Celeron G3900E
CPU 2: Intel Core i3-2312M

PassMark - Single thread mark
CPU 1
CPU 2
1499
866
PassMark - CPU mark
CPU 1
CPU 2
2034
1175
Name Intel Celeron G3900E Intel Core i3-2312M
PassMark - Single thread mark 1499 866
PassMark - CPU mark 2034 1175
Geekbench 4 - Single Core 1963
Geekbench 4 - Multi-Core 3645

Compare specifications (specs)

Intel Celeron G3900E Intel Core i3-2312M

Essentials

Architecture codename Skylake Sandy Bridge
Launch date Q1'16 20 February 2011
Place in performance rating 1719 1699
Processor Number G3900E i3-2312M
Series Intel® Celeron® Processor G Series Legacy Intel® Core™ Processors
Status Launched Launched
Vertical segment Embedded Mobile
Launch price (MSRP) $225

Performance

64 bit support
Base frequency 2.40 GHz 2.10 GHz
Bus Speed 8 GT/s DMI3 5 GT/s DMI
Manufacturing process technology 14 nm 32 nm
Maximum core temperature 100°C 85 C
Number of cores 2 2
Number of threads 2 4
Die size 149 mm
L1 cache 128 KB
L2 cache 512 KB
L3 cache 3072 KB
Maximum case temperature (TCase) 85 °C
Maximum frequency 2.1 GHz
Transistor count 624 Million

Memory

Max memory channels 2 2
Maximum memory bandwidth 34.1 GB/s 21.3 GB/s
Maximum memory size 64 GB 16 GB
Supported memory types DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V DDR3 1066/1333

Graphics

Device ID 0x1902 0x116
Graphics base frequency 350 MHz 650 MHz
Graphics max dynamic frequency 950 MHz 1.10 GHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 64 GB
Processor graphics Intel® HD Graphics 510 Intel® HD Graphics 3000
Graphics max frequency 1.1 GHz
Intel® Flexible Display Interface (Intel® FDI)

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3 2
CRT
SDVO
Wireless Display (WiDi) support

Graphics image quality

4K resolution support
Max resolution over DisplayPort 4096x2304@60Hz
Max resolution over eDP 4096x2304@60Hz
Max resolution over HDMI 1.4 4096x2304@24Hz

Graphics API support

DirectX 12
OpenGL 4.4

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 42mm x 28mm 37.5mm x 37.5mm *rPGA988B);
Sockets supported FCBGA1440 PPGA988
Thermal Design Power (TDP) 35 Watt 35 Watt

Peripherals

Max number of PCIe lanes 16 16
PCI Express revision 3.0 2.0
PCIe configurations Up to 1x16, 2x8, 1x8+2x4 1x16, 2x8, 1x8+2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Intel® Trusted Execution technology (TXT)
Secure Boot
Anti-Theft technology
Intel® Identity Protection technology

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2 Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
4G WiMAX Wireless
Flexible Display interface (FDI)
Intel® Advanced Vector Extensions (AVX)
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® My WiFi technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)