Architektur Codename |
Skylake |
Sandy Bridge |
Startdatum |
Q1'16 |
20 February 2011 |
Platz in der Leistungsbewertung |
1718 |
1699 |
Processor Number |
G3900E |
i3-2312M |
Serie |
Intel® Celeron® Processor G Series |
Legacy Intel® Core™ Processors |
Status |
Launched |
Launched |
Vertikales Segment |
Embedded |
Mobile |
Einführungspreis (MSRP) |
|
$225 |
64-Bit-Unterstützung |
|
|
Base frequency |
2.40 GHz |
2.10 GHz |
Bus Speed |
8 GT/s DMI3 |
5 GT/s DMI |
Fertigungsprozesstechnik |
14 nm |
32 nm |
Maximale Kerntemperatur |
100°C |
85 C |
Anzahl der Adern |
2 |
2 |
Anzahl der Gewinde |
2 |
4 |
Matrizengröße |
|
149 mm |
L1 Cache |
|
128 KB |
L2 Cache |
|
512 KB |
L3 Cache |
|
3072 KB |
Maximale Gehäusetemperatur (TCase) |
|
85 °C |
Maximale Frequenz |
|
2.1 GHz |
Anzahl der Transistoren |
|
624 Million |
Maximale Speicherkanäle |
2 |
2 |
Maximale Speicherbandbreite |
34.1 GB/s |
21.3 GB/s |
Maximale Speichergröße |
64 GB |
16 GB |
Unterstützte Speichertypen |
DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V |
DDR3 1066/1333 |
Device ID |
0x1902 |
0x116 |
Graphics base frequency |
350 MHz |
650 MHz |
Graphics max dynamic frequency |
950 MHz |
1.10 GHz |
Intel® Clear Video HD Technologie |
|
|
Intel® Clear Video Technologie |
|
|
Intel® InTru™ 3D-Technologie |
|
|
Intel® Quick Sync Video |
|
|
Maximaler Videospeicher |
64 GB |
|
Prozessorgrafiken |
Intel® HD Graphics 510 |
Intel® HD Graphics 3000 |
Grafik Maximalfrequenz |
|
1.1 GHz |
Intel® Flexible Display Interface (Intel® FDI) |
|
|
DisplayPort |
|
|
DVI |
|
|
eDP |
|
|
HDMI |
|
|
Anzahl der unterstützten Anzeigen |
3 |
2 |
CRT |
|
|
SDVO |
|
|
Unterstützung für Wireless Display (WiDi) |
|
|
Unterstützung von 4K-Auflösungen |
|
|
Maximale Auflösung über DisplayPort |
4096x2304@60Hz |
|
Maximale Auflösung über eDP |
4096x2304@60Hz |
|
Maximale Auflösung über HDMI 1.4 |
4096x2304@24Hz |
|
DirectX |
12 |
|
OpenGL |
4.4 |
|
Low Halogen Options Available |
|
|
Maximale Anzahl von CPUs in einer Konfiguration |
1 |
1 |
Package Size |
42mm x 28mm |
37.5mm x 37.5mm *rPGA988B); |
Unterstützte Sockel |
FCBGA1440 |
PPGA988 |
Thermische Designleistung (TDP) |
35 Watt |
35 Watt |
Maximale Anzahl von PCIe-Strecken |
16 |
16 |
PCI Express Revision |
3.0 |
2.0 |
PCIe configurations |
Up to 1x16, 2x8, 1x8+2x4 |
1x16, 2x8, 1x8+2x4 |
Scalability |
1S Only |
|
Execute Disable Bit (EDB) |
|
|
Intel® Memory Protection Extensions (Intel® MPX) |
|
|
Intel® OS Guard |
|
|
Intel® Secure Key Technologie |
|
|
Intel® Software Guard Extensions (Intel® SGX) |
|
|
Intel® Trusted Execution Technologie (TXT) |
|
|
Secure Boot |
|
|
Anti-Theft Technologie |
|
|
Intel® Identity Protection Technologie |
|
|
Enhanced Intel SpeedStep® Technologie |
|
|
Idle States |
|
|
Befehlssatzerweiterungen |
Intel® SSE4.1, Intel® SSE4.2 |
Intel® AVX |
Intel 64 |
|
|
Intel® AES New Instructions |
|
|
Intel® Hyper-Threading Technologie |
|
|
Intel® Stable Image Platform Program (SIPP) |
|
|
Intel® TSX-NI |
|
|
Intel® Turbo Boost Technologie |
|
|
Intel® vPro™ Platform Eligibility |
|
|
Thermal Monitoring |
|
|
4G WiMAX Wireless |
|
|
Flexible Display interface (FDI) |
|
|
Intel® Advanced Vector Extensions (AVX) |
|
|
Intel® Demand Based Switching |
|
|
Intel® Fast Memory Access |
|
|
Intel® Flex Memory Access |
|
|
Intel® My WiFi Technologie |
|
|
Intel® Virtualization Technology (VT-x) |
|
|
Intel® Virtualization Technology for Directed I/O (VT-d) |
|
|
Intel® VT-x with Extended Page Tables (EPT) |
|
|
AMD Virtualization (AMD-V™) |
|
|