Intel Celeron G470 vs Intel Pentium 4 HT 620
Comparative analysis of Intel Celeron G470 and Intel Pentium 4 HT 620 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron G470
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 90 nm
- 2.4x lower typical power consumption: 35 Watt vs 84 Watt
Manufacturing process technology | 32 nm vs 90 nm |
Thermal Design Power (TDP) | 35 Watt vs 84 Watt |
Reasons to consider the Intel Pentium 4 HT 620
- Around 3% higher maximum core temperature: 67.7°C vs 65.5°C
Maximum core temperature | 67.7°C vs 65.5°C |
Compare benchmarks
CPU 1: Intel Celeron G470
CPU 2: Intel Pentium 4 HT 620
Name | Intel Celeron G470 | Intel Pentium 4 HT 620 |
---|---|---|
PassMark - Single thread mark | 837 | |
PassMark - CPU mark | 570 | |
Geekbench 4 - Single Core | 801 | |
Geekbench 4 - Multi-Core | 906 |
Compare specifications (specs)
Intel Celeron G470 | Intel Pentium 4 HT 620 | |
---|---|---|
Essentials |
||
Architecture codename | Sandy Bridge | Prescott |
Launch date | Q2'13 | February 2005 |
Place in performance rating | 2510 | 2527 |
Processor Number | G470 | 620 |
Series | Legacy Intel® Celeron® Processor | Legacy Intel® Pentium® Processor |
Status | Launched | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
||
64 bit support | ||
Base frequency | 2.00 GHz | 2.80 GHz |
Bus Speed | 5 GT/s DMI | 800 MHz FSB |
Manufacturing process technology | 32 nm | 90 nm |
Maximum core temperature | 65.5°C | 67.7°C |
Number of cores | 1 | 1 |
Number of threads | 2 | |
Die size | 135 mm2 | |
L1 cache | 28 KB | |
L2 cache | 2048 KB | |
Maximum case temperature (TCase) | 68 °C | |
Maximum frequency | 2.8 GHz | |
Transistor count | 169 million | |
VID voltage range | 1.200V-1.400V | |
Memory |
||
Max memory channels | 2 | |
Maximum memory bandwidth | 17 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1066/1333 | DDR1, DDR2, DDR3 |
Graphics |
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Graphics base frequency | 650 MHz | |
Graphics max dynamic frequency | 1.00 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1155 | PLGA775 |
Thermal Design Power (TDP) | 35 Watt | 84 Watt |
Peripherals |
||
PCI Express revision | 2.0 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |