Intel Celeron J1750 vs Intel Celeron E3400
Comparative analysis of Intel Celeron J1750 and Intel Celeron E3400 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Celeron J1750
- CPU is newer: launch date 3 year(s) 7 month(s) later
- Around 35% higher maximum core temperature: 100°C vs 74.1°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- 6.5x lower typical power consumption: 10 Watt vs 65 Watt
Launch date | 1 September 2013 vs January 2010 |
Maximum core temperature | 100°C vs 74.1°C |
Manufacturing process technology | 22 nm vs 45 nm |
Thermal Design Power (TDP) | 10 Watt vs 65 Watt |
Reasons to consider the Intel Celeron E3400
- Around 8% higher clock speed: 2.6 GHz vs 2.41 GHz
- Around 14% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 52% better performance in PassMark - Single thread mark: 1004 vs 659
- Around 45% better performance in PassMark - CPU mark: 860 vs 595
Specifications (specs) | |
Maximum frequency | 2.6 GHz vs 2.41 GHz |
L1 cache | 64 KB (per core) vs 112 KB |
Benchmarks | |
PassMark - Single thread mark | 1004 vs 659 |
PassMark - CPU mark | 860 vs 595 |
Compare benchmarks
CPU 1: Intel Celeron J1750
CPU 2: Intel Celeron E3400
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron J1750 | Intel Celeron E3400 |
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PassMark - Single thread mark | 659 | 1004 |
PassMark - CPU mark | 595 | 860 |
Geekbench 4 - Single Core | 301 | |
Geekbench 4 - Multi-Core | 510 |
Compare specifications (specs)
Intel Celeron J1750 | Intel Celeron E3400 | |
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Essentials |
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Architecture codename | Bay Trail | Wolfdale |
Launch date | 1 September 2013 | January 2010 |
Launch price (MSRP) | $72 | $76 |
Place in performance rating | 2747 | 2738 |
Processor Number | J1750 | E3400 |
Series | Intel® Celeron® Processor J Series | Legacy Intel® Celeron® Processor |
Status | Launched | Discontinued |
Vertical segment | Desktop | Desktop |
Price now | $75.47 | |
Value for money (0-100) | 5.63 | |
Performance |
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64 bit support | ||
Base frequency | 2.41 GHz | 2.60 GHz |
L1 cache | 112 KB | 64 KB (per core) |
L2 cache | 1 MB | 1024 KB (shared) |
Manufacturing process technology | 22 nm | 45 nm |
Maximum core temperature | 100°C | 74.1°C |
Maximum frequency | 2.41 GHz | 2.6 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | |
Bus Speed | 800 MHz FSB | |
Die size | 82 mm | |
Transistor count | 228 million | |
VID voltage range | 0.8500V-1.3625V | |
Memory |
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Max memory channels | 2 | |
Maximum memory size | 8 GB | |
Supported memory types | DDR3L 1333 | DDR1, DDR2, DDR3 |
Graphics |
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Graphics base frequency | 688 MHz | |
Graphics max dynamic frequency | 750 MHz | |
Graphics max frequency | 750 MHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 25mm X 27mm | |
Sockets supported | FCBGA1170 | LGA775 |
Thermal Design Power (TDP) | 10 Watt | 65 Watt |
Peripherals |
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Max number of PCIe lanes | 4 | |
PCI Express revision | 2.0 | |
PCIe configurations | X4, X2, X1 | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Rapid Storage technology (RST) | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Idle States | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |