Intel Celeron M 900 vs Intel Atom N280
Comparative analysis of Intel Celeron M 900 and Intel Atom N280 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Celeron M 900
- CPU is newer: launch date 2 month(s) later
- Around 33% higher clock speed: 2.2 GHz vs 1.66 GHz
- Around 17% higher maximum core temperature: 105°C vs 90°C
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 12% better performance in PassMark - Single thread mark: 263 vs 234
- Around 30% better performance in PassMark - CPU mark: 204 vs 157
Specifications (specs) | |
Launch date | 1 April 2009 vs 1 February 2009 |
Maximum frequency | 2.2 GHz vs 1.66 GHz |
Maximum core temperature | 105°C vs 90°C |
L2 cache | 1024 KB vs 512 KB |
Benchmarks | |
PassMark - Single thread mark | 263 vs 234 |
PassMark - CPU mark | 204 vs 157 |
Reasons to consider the Intel Atom N280
- 1 more threads: 2 vs 1
- 11.7x lower typical power consumption: 2.5 Watt vs 35 Watt
Number of threads | 2 vs 1 |
Thermal Design Power (TDP) | 2.5 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Celeron M 900
CPU 2: Intel Atom N280
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron M 900 | Intel Atom N280 |
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PassMark - Single thread mark | 263 | 234 |
PassMark - CPU mark | 204 | 157 |
Compare specifications (specs)
Intel Celeron M 900 | Intel Atom N280 | |
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Essentials |
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Architecture codename | Penryn | Diamondville |
Launch date | 1 April 2009 | 1 February 2009 |
Launch price (MSRP) | $70 | |
Place in performance rating | 3260 | 3272 |
Processor Number | 900 | N280 |
Series | Legacy Intel® Celeron® Processor | Legacy Intel Atom® Processors |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 2.20 GHz | 1.66 GHz |
Bus Speed | 800 MHz FSB | 667 MHz FSB |
Die size | 107 mm2 | 26 mm2 |
Front-side bus (FSB) | 800 MHz | 667 MHz |
L2 cache | 1024 KB | 512 KB |
Manufacturing process technology | 45 nm | 45 nm |
Maximum core temperature | 105°C | 90°C |
Maximum frequency | 2.2 GHz | 1.66 GHz |
Number of cores | 1 | 1 |
Number of threads | 1 | 2 |
Transistor count | 410 million | 47 million |
L1 cache | 56 KB | |
VID voltage range | 0.9V-1.1625V | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 35mm x 35mm | 22mm x 22mm |
Sockets supported | PGA478 | PBGA437 |
Thermal Design Power (TDP) | 35 Watt | 2.5 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
Intel® Demand Based Switching | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |