Intel Celeron 847 vs Intel Celeron M 900
Comparative analysis of Intel Celeron 847 and Intel Celeron M 900 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Celeron 847
- CPU is newer: launch date 2 year(s) 2 month(s) later
- 1 more cores, run more applications at once: 2 vs 1
- 1 more threads: 2 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 2.1x lower typical power consumption: 17 Watt vs 35 Watt
- Around 80% better performance in PassMark - Single thread mark: 473 vs 263
- 2.3x better performance in PassMark - CPU mark: 479 vs 204
Specifications (specs) | |
Launch date | 19 June 2011 vs 1 April 2009 |
Number of cores | 2 vs 1 |
Number of threads | 2 vs 1 |
Manufacturing process technology | 32 nm vs 45 nm |
Thermal Design Power (TDP) | 17 Watt vs 35 Watt |
Benchmarks | |
PassMark - Single thread mark | 473 vs 263 |
PassMark - CPU mark | 479 vs 204 |
Reasons to consider the Intel Celeron M 900
- Around 100% higher clock speed: 2.2 GHz vs 1.1 GHz
- Around 5% higher maximum core temperature: 105°C vs 100
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 2.2 GHz vs 1.1 GHz |
Maximum core temperature | 105°C vs 100 |
L2 cache | 1024 KB vs 512 KB |
Compare benchmarks
CPU 1: Intel Celeron 847
CPU 2: Intel Celeron M 900
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Celeron 847 | Intel Celeron M 900 |
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PassMark - Single thread mark | 473 | 263 |
PassMark - CPU mark | 479 | 204 |
Geekbench 4 - Single Core | 194 | |
Geekbench 4 - Multi-Core | 339 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.701 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 10.694 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.088 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.364 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 0.718 |
Compare specifications (specs)
Intel Celeron 847 | Intel Celeron M 900 | |
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Essentials |
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Architecture codename | Sandy Bridge | Penryn |
Launch date | 19 June 2011 | 1 April 2009 |
Launch price (MSRP) | $315 | $70 |
Place in performance rating | 3280 | 3260 |
Price now | $315 | |
Processor Number | 847 | 900 |
Series | Legacy Intel® Celeron® Processor | Legacy Intel® Celeron® Processor |
Status | Launched | Discontinued |
Value for money (0-100) | 0.88 | |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 1.10 GHz | 2.20 GHz |
Bus Speed | 5 GT/s DMI | 800 MHz FSB |
Die size | 131 mm | 107 mm2 |
L1 cache | 128 KB | |
L2 cache | 512 KB | 1024 KB |
L3 cache | 2048 KB | |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 100 | 105°C |
Maximum frequency | 1.1 GHz | 2.2 GHz |
Number of cores | 2 | 1 |
Number of threads | 2 | 1 |
Transistor count | 504 million | 410 million |
Front-side bus (FSB) | 800 MHz | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21.3 GB/s | |
Maximum memory size | 16 GB | |
Supported memory types | DDR3 1066/1333 | |
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 800 MHz | |
Graphics max frequency | 800 MHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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CRT | ||
DisplayPort | ||
eDP | ||
HDMI | ||
Number of displays supported | 2 | |
SDVO | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 31.0mm x 24.0mm (BGA1023) | 35mm x 35mm |
Sockets supported | FCBGA1023 | PGA478 |
Thermal Design Power (TDP) | 17 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16, 2x8, 1x8 2x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |