Intel Core 2 Duo E6540 vs AMD Phenom II X4 B97
Comparative analysis of Intel Core 2 Duo E6540 and AMD Phenom II X4 B97 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo E6540
- Around 46% lower typical power consumption: 65 Watt vs 95 Watt
| Thermal Design Power (TDP) | 65 Watt vs 95 Watt |
Reasons to consider the AMD Phenom II X4 B97
- 2 more cores, run more applications at once: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- Around 36% better performance in PassMark - Single thread mark: 1321 vs 969
- 3.1x better performance in PassMark - CPU mark: 2535 vs 808
| Specifications (specs) | |
| Number of cores | 4 vs 2 |
| Manufacturing process technology | 45 nm vs 65 nm |
| Benchmarks | |
| PassMark - Single thread mark | 1321 vs 969 |
| PassMark - CPU mark | 2535 vs 808 |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6540
CPU 2: AMD Phenom II X4 B97
| PassMark - Single thread mark |
|
|
||||
| PassMark - CPU mark |
|
|
| Name | Intel Core 2 Duo E6540 | AMD Phenom II X4 B97 |
|---|---|---|
| PassMark - Single thread mark | 969 | 1321 |
| PassMark - CPU mark | 808 | 2535 |
| Geekbench 4 - Single Core | 430 | |
| Geekbench 4 - Multi-Core | 1447 |
Compare specifications (specs)
| Intel Core 2 Duo E6540 | AMD Phenom II X4 B97 | |
|---|---|---|
Essentials |
||
| Architecture codename | Conroe | Deneb |
| Launch date | Q3'07 | May 2010 |
| Place in performance rating | 2339 | 2347 |
| Processor Number | E6540 | |
| Series | Legacy Intel® Core™ Processors | AMD Business Class - AMD Phenom X4 Quad-Core |
| Status | Discontinued | |
| Vertical segment | Desktop | Desktop |
| Family | AMD Phenom | |
| Launch price (MSRP) | $100 | |
| OPN Tray | HDXB97WFK4DGM | |
| Price now | $56.99 | |
| Value for money (0-100) | 20.09 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.33 GHz | 3.2 GHz |
| Bus Speed | 1333 MHz FSB | |
| Die size | 143 mm2 | 258 mm |
| Manufacturing process technology | 65 nm | 45 nm |
| Maximum core temperature | 72°C | |
| Number of cores | 2 | 4 |
| Transistor count | 291 million | 758 million |
| VID voltage range | 0.8500V-1.5V | |
| L1 cache | 128 KB (per core) | |
| L2 cache | 512 KB (per core) | |
| L3 cache | 6144 KB (shared) | |
| Maximum frequency | 3.2 GHz | |
| Number of threads | 4 | |
| Unlocked | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Package Size | 37.5mm x 37.5mm | |
| Sockets supported | PLGA775 | AM3 |
| Thermal Design Power (TDP) | 65 Watt | 95 Watt |
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
Memory |
||
| Supported memory types | DDR3 | |