Intel Core 2 Duo E6540 vs Intel Pentium G850
Comparative analysis of Intel Core 2 Duo E6540 and Intel Pentium G850 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo E6540
- Around 4% higher maximum core temperature: 72°C vs 69.1°C
Maximum core temperature | 72°C vs 69.1°C |
Reasons to consider the Intel Pentium G850
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 39% better performance in PassMark - Single thread mark: 1351 vs 969
- Around 79% better performance in PassMark - CPU mark: 1443 vs 808
Specifications (specs) | |
Manufacturing process technology | 32 nm vs 65 nm |
Benchmarks | |
PassMark - Single thread mark | 1351 vs 969 |
PassMark - CPU mark | 1443 vs 808 |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6540
CPU 2: Intel Pentium G850
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core 2 Duo E6540 | Intel Pentium G850 |
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PassMark - Single thread mark | 969 | 1351 |
PassMark - CPU mark | 808 | 1443 |
Geekbench 4 - Single Core | 506 | |
Geekbench 4 - Multi-Core | 917 |
Compare specifications (specs)
Intel Core 2 Duo E6540 | Intel Pentium G850 | |
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Essentials |
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Architecture codename | Conroe | Sandy Bridge |
Launch date | Q3'07 | May 2011 |
Place in performance rating | 2329 | 2337 |
Processor Number | E6540 | G850 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
Status | Discontinued | Launched |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $27 | |
Price now | $29.99 | |
Value for money (0-100) | 26.17 | |
Performance |
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64 bit support | ||
Base frequency | 2.33 GHz | 2.90 GHz |
Bus Speed | 1333 MHz FSB | 5 GT/s DMI |
Die size | 143 mm2 | 131 mm |
Manufacturing process technology | 65 nm | 32 nm |
Maximum core temperature | 72°C | 69.1°C |
Number of cores | 2 | 2 |
Transistor count | 291 million | 504 million |
VID voltage range | 0.8500V-1.5V | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 3072 KB (shared) | |
Maximum frequency | 2.9 GHz | |
Number of threads | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | PLGA775 | FCLGA1155 |
Thermal Design Power (TDP) | 65 Watt | 65 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Optane™ Memory Supported | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 21 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1066/1333 | |
Graphics |
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Graphics base frequency | 850 MHz | |
Graphics max dynamic frequency | 1.10 GHz | |
Graphics max frequency | 1.1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Wireless Display (WiDi) support | ||
Peripherals |
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PCI Express revision | 2.0 |