Intel Core 2 Duo E6540 vs Intel Pentium G850

Comparative analysis of Intel Core 2 Duo E6540 and Intel Pentium G850 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo E6540

Intel Pentium G850

Differences

Reasons to consider the Intel Core 2 Duo E6540

Around 4% higher maximum core temperature: 72°C vs 69.1°C

Maximum core temperature	72°C vs 69.1°C

Reasons to consider the Intel Pentium G850

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 40% better performance in PassMark - Single thread mark: 1357 vs 969
Around 77% better performance in PassMark - CPU mark: 1433 vs 808

Specifications (specs)
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	1357 vs 969
PassMark - CPU mark	1433 vs 808

Compare benchmarks

CPU 1: Intel Core 2 Duo E6540
CPU 2: Intel Pentium G850

PassMark - Single thread mark

CPU 1

CPU 2

969

1357

PassMark - CPU mark

CPU 1

CPU 2

808

1433

Name	Intel Core 2 Duo E6540	Intel Pentium G850
PassMark - Single thread mark	969	1357
PassMark - CPU mark	808	1433
Geekbench 4 - Single Core		506
Geekbench 4 - Multi-Core		917

Compare specifications (specs)

	Intel Core 2 Duo E6540	Intel Pentium G850
Essentials
Architecture codename	Conroe	Sandy Bridge
Launch date	Q3'07	May 2011
Place in performance rating	2231	2240
Processor Number	E6540	G850
Series	Legacy Intel® Core™ Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Launched
Vertical segment	Desktop	Desktop
Launch price (MSRP)		$27
Price now		$29.99
Value for money (0-100)		26.17
Performance
64 bit support
Base frequency	2.33 GHz	2.90 GHz
Bus Speed	1333 MHz FSB	5 GT/s DMI
Die size	143 mm2	131 mm
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	72°C	69.1°C
Number of cores	2	2
Transistor count	291 million	504 million
VID voltage range	0.8500V-1.5V
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		3072 KB (shared)
Maximum frequency		2.9 GHz
Number of threads		2
Compatibility
Low Halogen Options Available
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	PLGA775	FCLGA1155
Thermal Design Power (TDP)	65 Watt	65 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Flexible Display interface (FDI)
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Optane™ Memory Supported
Intel® vPro™ Platform Eligibility
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
Max memory channels		2
Maximum memory bandwidth		21 GB/s
Maximum memory size		32 GB
Supported memory types		DDR3 1066/1333
Graphics
Graphics base frequency		850 MHz
Graphics max dynamic frequency		1.10 GHz
Graphics max frequency		1.1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics
Graphics interfaces
Number of displays supported		2
Wireless Display (WiDi) support
Peripherals
PCI Express revision		2.0