Intel Core 2 Duo E6540 vs Intel Celeron G530T

Comparative analysis of Intel Core 2 Duo E6540 and Intel Celeron G530T processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Core 2 Duo E6540

Intel Celeron G530T

Differences

Reasons to consider the Intel Core 2 Duo E6540

Around 11% higher maximum core temperature: 72°C vs 65.0°C
Around 1% better performance in PassMark - Single thread mark: 969 vs 962

Specifications (specs)
Maximum core temperature	72°C vs 65.0°C
Benchmarks
PassMark - Single thread mark	969 vs 962

Reasons to consider the Intel Celeron G530T

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 86% lower typical power consumption: 35 Watt vs 65 Watt
Around 31% better performance in PassMark - CPU mark: 1056 vs 808

Specifications (specs)
Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	35 Watt vs 65 Watt
Benchmarks
PassMark - CPU mark	1056 vs 808

Compare benchmarks

CPU 1: Intel Core 2 Duo E6540
CPU 2: Intel Celeron G530T

PassMark - Single thread mark

CPU 1

CPU 2

969

962

PassMark - CPU mark

CPU 1

CPU 2

808

1056

Name	Intel Core 2 Duo E6540	Intel Celeron G530T
PassMark - Single thread mark	969	962
PassMark - CPU mark	808	1056

Compare specifications (specs)

	Intel Core 2 Duo E6540	Intel Celeron G530T
Essentials
Architecture codename	Conroe	Sandy Bridge
Launch date	Q3'07	September 2011
Place in performance rating	2329	2336
Processor Number	E6540	G530T
Series	Legacy Intel® Core™ Processors	Legacy Intel® Celeron® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.33 GHz	2.00 GHz
Bus Speed	1333 MHz FSB	5 GT/s DMI
Die size	143 mm2	131 mm
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	72°C	65.0°C
Number of cores	2	2
Transistor count	291 million	504 million
VID voltage range	0.8500V-1.5V
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		2048 KB (shared)
Maximum frequency		2 GHz
Number of threads		2
Compatibility
Low Halogen Options Available
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	PLGA775	FCLGA1155
Thermal Design Power (TDP)	65 Watt	35 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Flexible Display interface (FDI)
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Optane™ Memory Supported
Intel® vPro™ Platform Eligibility
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
Max memory channels		2
Maximum memory bandwidth		17 GB/s
Maximum memory size		32 GB
Supported memory types		DDR3 1066
Graphics
Graphics base frequency		650 MHz
Graphics max dynamic frequency		1.00 GHz
Graphics max frequency		1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics
Graphics interfaces
Number of displays supported		2
Wireless Display (WiDi) support
Peripherals
PCI Express revision		2.0