Intel Core 2 Duo E6700 vs Intel Core i3-3240
Comparative analysis of Intel Core 2 Duo E6700 and Intel Core i3-3240 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-3240
- Around 9% higher maximum core temperature: 65.3°C vs 60.1°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- Around 18% lower typical power consumption: 55 Watt vs 65 Watt
- Around 74% better performance in PassMark - Single thread mark: 1782 vs 1023
- 2.3x better performance in PassMark - CPU mark: 2321 vs 990
- Around 90% better performance in Geekbench 4 - Single Core: 603 vs 317
- 2.4x better performance in Geekbench 4 - Multi-Core: 1343 vs 564
Specifications (specs) | |
Maximum core temperature | 65.3°C vs 60.1°C |
Manufacturing process technology | 22 nm vs 65 nm |
Thermal Design Power (TDP) | 55 Watt vs 65 Watt |
Benchmarks | |
PassMark - Single thread mark | 1782 vs 1023 |
PassMark - CPU mark | 2321 vs 990 |
Geekbench 4 - Single Core | 603 vs 317 |
Geekbench 4 - Multi-Core | 1343 vs 564 |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6700
CPU 2: Intel Core i3-3240
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core 2 Duo E6700 | Intel Core i3-3240 |
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PassMark - Single thread mark | 1023 | 1782 |
PassMark - CPU mark | 990 | 2321 |
Geekbench 4 - Single Core | 317 | 603 |
Geekbench 4 - Multi-Core | 564 | 1343 |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.244 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 37.104 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.26 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.087 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.68 | |
GFXBench 4.0 - T-Rex (Frames) | 1356 | |
GFXBench 4.0 - T-Rex (Fps) | 1356 |
Compare specifications (specs)
Intel Core 2 Duo E6700 | Intel Core i3-3240 | |
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Essentials |
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Architecture codename | Conroe | Ivy Bridge |
Launch date | Q3'06 | September 2012 |
Place in performance rating | 2702 | 2687 |
Processor Number | E6700 | i3-3240 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Launched |
Vertical segment | Desktop | Desktop |
Launch price (MSRP) | $75 | |
Price now | $67.99 | |
Value for money (0-100) | 18.67 | |
Performance |
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64 bit support | ||
Base frequency | 2.66 GHz | 3.40 GHz |
Bus Speed | 1066 MHz FSB | 5 GT/s DMI |
Die size | 143 mm2 | 94 mm |
Manufacturing process technology | 65 nm | 22 nm |
Maximum core temperature | 60.1°C | 65.3°C |
Number of cores | 2 | 2 |
Transistor count | 291 million | |
VID voltage range | 0.8500V-1.5V | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 3072 KB (shared) | |
Maximum case temperature (TCase) | 65 °C | |
Maximum frequency | 3.4 GHz | |
Number of threads | 4 | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Scenario Design Power (SDP) | 0 W | |
Sockets supported | PLGA775 | FCLGA1155 |
Thermal Design Power (TDP) | 65 Watt | 55 Watt |
Max number of CPUs in a configuration | 1 | |
Thermal Solution | 2011C | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Anti-Theft technology | ||
Intel® Identity Protection technology | ||
Intel® Secure Key technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel® Advanced Vector Extensions (AVX) | ||
Intel® My WiFi technology | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1333/1600 | |
Graphics |
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Device ID | 0x152 | |
Graphics base frequency | 650 MHz | |
Graphics max dynamic frequency | 1.05 GHz | |
Graphics max frequency | 1.05 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel® HD Graphics 2500 | |
Graphics interfaces |
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Number of displays supported | 3 | |
Wireless Display (WiDi) support | ||
Peripherals |
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PCI Express revision | 2.0 | |
PCIe configurations | up to 1x16, 2x8, 1x8 & 2x4 |