Intel Core 2 Duo E6850 vs Intel Core 2 Duo E6600
Comparative analysis of Intel Core 2 Duo E6850 and Intel Core 2 Duo E6600 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo E6850
- Around 20% higher maximum core temperature: 72°C vs 60.1°C
- Around 25% better performance in PassMark - Single thread mark: 1188 vs 947
- Around 23% better performance in PassMark - CPU mark: 1154 vs 942
- Around 29% better performance in Geekbench 4 - Single Core: 401 vs 310
- Around 32% better performance in Geekbench 4 - Multi-Core: 702 vs 533
Specifications (specs) | |
Maximum core temperature | 72°C vs 60.1°C |
Benchmarks | |
PassMark - Single thread mark | 1188 vs 947 |
PassMark - CPU mark | 1154 vs 942 |
Geekbench 4 - Single Core | 401 vs 310 |
Geekbench 4 - Multi-Core | 702 vs 533 |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6850
CPU 2: Intel Core 2 Duo E6600
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core 2 Duo E6850 | Intel Core 2 Duo E6600 |
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PassMark - Single thread mark | 1188 | 947 |
PassMark - CPU mark | 1154 | 942 |
Geekbench 4 - Single Core | 401 | 310 |
Geekbench 4 - Multi-Core | 702 | 533 |
Compare specifications (specs)
Intel Core 2 Duo E6850 | Intel Core 2 Duo E6600 | |
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Essentials |
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Architecture codename | Conroe | Conroe |
Launch date | Q3'07 | Q3'06 |
Place in performance rating | 2528 | 2771 |
Processor Number | E6850 | E6600 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.00 GHz | 2.40 GHz |
Bus Speed | 1333 MHz FSB | 1066 MHz FSB |
Die size | 143 mm2 | 143 mm2 |
Manufacturing process technology | 65 nm | 65 nm |
Maximum core temperature | 72°C | 60.1°C |
Number of cores | 2 | 2 |
Transistor count | 291 million | 291 million |
VID voltage range | 0.8500V-1.5V | 0.8500V-1.5V |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | PLGA775 | PLGA775 |
Thermal Design Power (TDP) | 65 Watt | 65 Watt |
Scenario Design Power (SDP) | 0 W | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) |