Intel Core 2 Duo E6850 vs Intel Pentium 4 511
Comparative analysis of Intel Core 2 Duo E6850 and Intel Pentium 4 511 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo E6850
- 1 more cores, run more applications at once: 2 vs 1
- Around 6% higher maximum core temperature: 72°C vs 67.7°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
- Around 29% lower typical power consumption: 65 Watt vs 84 Watt
Number of cores | 2 vs 1 |
Maximum core temperature | 72°C vs 67.7°C |
Manufacturing process technology | 65 nm vs 90 nm |
Thermal Design Power (TDP) | 65 Watt vs 84 Watt |
Reasons to consider the Intel Pentium 4 511
- Around 95% better performance in Geekbench 4 - Single Core: 781 vs 401
- Around 28% better performance in Geekbench 4 - Multi-Core: 899 vs 702
Benchmarks | |
Geekbench 4 - Single Core | 781 vs 401 |
Geekbench 4 - Multi-Core | 899 vs 702 |
Compare benchmarks
CPU 1: Intel Core 2 Duo E6850
CPU 2: Intel Pentium 4 511
Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core 2 Duo E6850 | Intel Pentium 4 511 |
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PassMark - Single thread mark | 1183 | |
PassMark - CPU mark | 1130 | |
Geekbench 4 - Single Core | 401 | 781 |
Geekbench 4 - Multi-Core | 702 | 899 |
Compare specifications (specs)
Intel Core 2 Duo E6850 | Intel Pentium 4 511 | |
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Essentials |
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Architecture codename | Conroe | Prescott |
Launch date | Q3'07 | January 2005 |
Place in performance rating | 2541 | 2562 |
Processor Number | E6850 | 511 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.00 GHz | 2.80 GHz |
Bus Speed | 1333 MHz FSB | 533 MHz FSB |
Die size | 143 mm2 | 112 mm2 |
Manufacturing process technology | 65 nm | 90 nm |
Maximum core temperature | 72°C | 67.7°C |
Number of cores | 2 | 1 |
Transistor count | 291 million | 125 million |
VID voltage range | 0.8500V-1.5V | 1.25V-1.400V |
L1 cache | 16 KB | |
L2 cache | 1024 KB | |
Maximum frequency | 2.8 GHz | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Sockets supported | PLGA775 | PLGA775 |
Thermal Design Power (TDP) | 65 Watt | 84 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Memory |
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Supported memory types | DDR1, DDR2, DDR3 |