Intel Core 2 Duo E6850 vs Intel Pentium 4 511

Comparative analysis of Intel Core 2 Duo E6850 and Intel Pentium 4 511 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Duo E6850

  • 1 more cores, run more applications at once: 2 vs 1
  • Around 6% higher maximum core temperature: 72°C vs 67.7°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
  • Around 29% lower typical power consumption: 65 Watt vs 84 Watt
Number of cores 2 vs 1
Maximum core temperature 72°C vs 67.7°C
Manufacturing process technology 65 nm vs 90 nm
Thermal Design Power (TDP) 65 Watt vs 84 Watt

Reasons to consider the Intel Pentium 4 511

  • Around 95% better performance in Geekbench 4 - Single Core: 781 vs 401
  • Around 28% better performance in Geekbench 4 - Multi-Core: 899 vs 702
Benchmarks
Geekbench 4 - Single Core 781 vs 401
Geekbench 4 - Multi-Core 899 vs 702

Compare benchmarks

CPU 1: Intel Core 2 Duo E6850
CPU 2: Intel Pentium 4 511

Geekbench 4 - Single Core
CPU 1
CPU 2
401
781
Geekbench 4 - Multi-Core
CPU 1
CPU 2
702
899
Name Intel Core 2 Duo E6850 Intel Pentium 4 511
PassMark - Single thread mark 1183
PassMark - CPU mark 1130
Geekbench 4 - Single Core 401 781
Geekbench 4 - Multi-Core 702 899

Compare specifications (specs)

Intel Core 2 Duo E6850 Intel Pentium 4 511

Essentials

Architecture codename Conroe Prescott
Launch date Q3'07 January 2005
Place in performance rating 2541 2562
Processor Number E6850 511
Series Legacy Intel® Core™ Processors Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.00 GHz 2.80 GHz
Bus Speed 1333 MHz FSB 533 MHz FSB
Die size 143 mm2 112 mm2
Manufacturing process technology 65 nm 90 nm
Maximum core temperature 72°C 67.7°C
Number of cores 2 1
Transistor count 291 million 125 million
VID voltage range 0.8500V-1.5V 1.25V-1.400V
L1 cache 16 KB
L2 cache 1024 KB
Maximum frequency 2.8 GHz

Compatibility

Low Halogen Options Available
Package Size 37.5mm x 37.5mm
Sockets supported PLGA775 PLGA775
Thermal Design Power (TDP) 65 Watt 84 Watt
Max number of CPUs in a configuration 1

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)

Memory

Supported memory types DDR1, DDR2, DDR3