Intel Core 2 Duo E6850 vs Intel Pentium 4 511

Comparative analysis of Intel Core 2 Duo E6850 and Intel Pentium 4 511 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo E6850

Intel Pentium 4 511

Differences

Reasons to consider the Intel Core 2 Duo E6850

1 more cores, run more applications at once: 2 vs 1
Around 6% higher maximum core temperature: 72°C vs 67.7°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
Around 29% lower typical power consumption: 65 Watt vs 84 Watt

Number of cores	2 vs 1
Maximum core temperature	72°C vs 67.7°C
Manufacturing process technology	65 nm vs 90 nm
Thermal Design Power (TDP)	65 Watt vs 84 Watt

Reasons to consider the Intel Pentium 4 511

Around 95% better performance in Geekbench 4 - Single Core: 781 vs 401
Around 28% better performance in Geekbench 4 - Multi-Core: 899 vs 702

Benchmarks
Geekbench 4 - Single Core	781 vs 401
Geekbench 4 - Multi-Core	899 vs 702

Compare benchmarks

CPU 1: Intel Core 2 Duo E6850
CPU 2: Intel Pentium 4 511

Geekbench 4 - Single Core

CPU 1

CPU 2

401

781

Geekbench 4 - Multi-Core

CPU 1

CPU 2

702

899

Name	Intel Core 2 Duo E6850	Intel Pentium 4 511
PassMark - Single thread mark	1187
PassMark - CPU mark	1147
Geekbench 4 - Single Core	401	781
Geekbench 4 - Multi-Core	702	899

Compare specifications (specs)

	Intel Core 2 Duo E6850	Intel Pentium 4 511
Essentials
Architecture codename	Conroe	Prescott
Launch date	Q3'07	January 2005
Place in performance rating	2541	2562
Processor Number	E6850	511
Series	Legacy Intel® Core™ Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.00 GHz	2.80 GHz
Bus Speed	1333 MHz FSB	533 MHz FSB
Die size	143 mm2	112 mm2
Manufacturing process technology	65 nm	90 nm
Maximum core temperature	72°C	67.7°C
Number of cores	2	1
Transistor count	291 million	125 million
VID voltage range	0.8500V-1.5V	1.25V-1.400V
L1 cache		16 KB
L2 cache		1024 KB
Maximum frequency		2.8 GHz
Compatibility
Low Halogen Options Available
Package Size	37.5mm x 37.5mm
Sockets supported	PLGA775	PLGA775
Thermal Design Power (TDP)	65 Watt	84 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Memory
Supported memory types		DDR1, DDR2, DDR3