Intel Core 2 Duo L7300 vs Intel Core 2 Duo T6500

Comparative analysis of Intel Core 2 Duo L7300 and Intel Core 2 Duo T6500 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo L7300

Intel Core 2 Duo T6500

Differences

Reasons to consider the Intel Core 2 Duo L7300

2.1x lower typical power consumption: 17 Watt vs 35 Watt

Thermal Design Power (TDP)	17 Watt vs 35 Watt

Reasons to consider the Intel Core 2 Duo T6500

Around 5% higher maximum core temperature: 105°C vs 100°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
Around 52% better performance in PassMark - Single thread mark: 836 vs 551
Around 39% better performance in PassMark - CPU mark: 747 vs 536

Specifications (specs)
Maximum core temperature	105°C vs 100°C
Manufacturing process technology	45 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	836 vs 551
PassMark - CPU mark	747 vs 536

Compare benchmarks

CPU 1: Intel Core 2 Duo L7300
CPU 2: Intel Core 2 Duo T6500

PassMark - Single thread mark

CPU 1

CPU 2

551

836

PassMark - CPU mark

CPU 1

CPU 2

536

747

Name	Intel Core 2 Duo L7300	Intel Core 2 Duo T6500
PassMark - Single thread mark	551	836
PassMark - CPU mark	536	747
Geekbench 4 - Single Core		249
Geekbench 4 - Multi-Core		441

Compare specifications (specs)

	Intel Core 2 Duo L7300	Intel Core 2 Duo T6500
Essentials
Architecture codename	Merom	Penryn
Launch date	Q2'07	1 January 2009
Place in performance rating	2905	2900
Processor Number	L7300	T6500
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Price now		$14.99
Value for money (0-100)		25.27
Performance
64 bit support
Base frequency	1.40 GHz	2.10 GHz
Bus Speed	800 MHz FSB	800 MHz FSB
Die size	143 mm2	107 mm2
Manufacturing process technology	65 nm	45 nm
Maximum core temperature	100°C	105°C
Number of cores	2	2
Transistor count	291 million	410 million
VID voltage range	0.975V-1.062V
Front-side bus (FSB)		800 MHz
L2 cache		2048 KB
Maximum frequency		2.1 GHz
Number of threads		2
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm
Sockets supported	PBGA479	PGA478
Thermal Design Power (TDP)	17 Watt	35 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)