Intel Core 2 Duo L7300 vs Intel Pentium Dual Core T4200

Comparative analysis of Intel Core 2 Duo L7300 and Intel Pentium Dual Core T4200 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo L7300

Intel Pentium Dual Core T4200

Differences

Reasons to consider the Intel Core 2 Duo L7300

2.1x lower typical power consumption: 17 Watt vs 35 Watt

Thermal Design Power (TDP)	17 Watt vs 35 Watt

Reasons to consider the Intel Pentium Dual Core T4200

Around 5% higher maximum core temperature: 105°C vs 100°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
Around 50% better performance in PassMark - Single thread mark: 824 vs 551
Around 45% better performance in PassMark - CPU mark: 775 vs 536

Specifications (specs)
Maximum core temperature	105°C vs 100°C
Manufacturing process technology	45 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	824 vs 551
PassMark - CPU mark	775 vs 536

Compare benchmarks

CPU 1: Intel Core 2 Duo L7300
CPU 2: Intel Pentium Dual Core T4200

PassMark - Single thread mark

CPU 1

CPU 2

551

824

PassMark - CPU mark

CPU 1

CPU 2

536

775

Name	Intel Core 2 Duo L7300	Intel Pentium Dual Core T4200
PassMark - Single thread mark	551	824
PassMark - CPU mark	536	775
Geekbench 4 - Single Core		244
Geekbench 4 - Multi-Core		427

Compare specifications (specs)

	Intel Core 2 Duo L7300	Intel Pentium Dual Core T4200
Essentials
Architecture codename	Merom	Penryn
Launch date	Q2'07	1 January 2009
Place in performance rating	2906	2912
Processor Number	L7300	T4200
Series	Legacy Intel® Core™ Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	1.40 GHz	2.00 GHz
Bus Speed	800 MHz FSB	800 MHz FSB
Die size	143 mm2	107 mm2
Manufacturing process technology	65 nm	45 nm
Maximum core temperature	100°C	105°C
Number of cores	2	2
Transistor count	291 million	410 million
VID voltage range	0.975V-1.062V
Front-side bus (FSB)		800 MHz
L1 cache		128 KB
L2 cache		1024 KB
Maximum frequency		2 GHz
Number of threads		2
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	35mm x 35mm
Sockets supported	PBGA479	PGA478
Thermal Design Power (TDP)	17 Watt	35 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Active Management technology (AMT)
Virtualization
Intel® Virtualization Technology (VT-x)