Intel Core 2 Duo L7300 vs Intel Pentium Dual Core T4200

Comparative analysis of Intel Core 2 Duo L7300 and Intel Pentium Dual Core T4200 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Duo L7300

  • 2.1x lower typical power consumption: 17 Watt vs 35 Watt
Thermal Design Power (TDP) 17 Watt vs 35 Watt

Reasons to consider the Intel Pentium Dual Core T4200

  • Around 5% higher maximum core temperature: 105°C vs 100°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
  • Around 50% better performance in PassMark - Single thread mark: 824 vs 551
  • Around 45% better performance in PassMark - CPU mark: 775 vs 536
Specifications (specs)
Maximum core temperature 105°C vs 100°C
Manufacturing process technology 45 nm vs 65 nm
Benchmarks
PassMark - Single thread mark 824 vs 551
PassMark - CPU mark 775 vs 536

Compare benchmarks

CPU 1: Intel Core 2 Duo L7300
CPU 2: Intel Pentium Dual Core T4200

PassMark - Single thread mark
CPU 1
CPU 2
551
824
PassMark - CPU mark
CPU 1
CPU 2
536
775
Name Intel Core 2 Duo L7300 Intel Pentium Dual Core T4200
PassMark - Single thread mark 551 824
PassMark - CPU mark 536 775
Geekbench 4 - Single Core 244
Geekbench 4 - Multi-Core 427

Compare specifications (specs)

Intel Core 2 Duo L7300 Intel Pentium Dual Core T4200

Essentials

Architecture codename Merom Penryn
Launch date Q2'07 1 January 2009
Place in performance rating 2905 2911
Processor Number L7300 T4200
Series Legacy Intel® Core™ Processors Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 1.40 GHz 2.00 GHz
Bus Speed 800 MHz FSB 800 MHz FSB
Die size 143 mm2 107 mm2
Manufacturing process technology 65 nm 45 nm
Maximum core temperature 100°C 105°C
Number of cores 2 2
Transistor count 291 million 410 million
VID voltage range 0.975V-1.062V
Front-side bus (FSB) 800 MHz
L1 cache 128 KB
L2 cache 1024 KB
Maximum frequency 2 GHz
Number of threads 2

Compatibility

Low Halogen Options Available
Package Size 35mm x 35mm 35mm x 35mm
Sockets supported PBGA479 PGA478
Thermal Design Power (TDP) 17 Watt 35 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® Active Management technology (AMT)

Virtualization

Intel® Virtualization Technology (VT-x)