Intel Core 2 Duo L7300 vs Intel Celeron B810

Comparative analysis of Intel Core 2 Duo L7300 and Intel Celeron B810 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo L7300

Intel Celeron B810

Differences

Reasons to consider the Intel Core 2 Duo L7300

2.1x lower typical power consumption: 17 Watt vs 35 Watt

Thermal Design Power (TDP)	17 Watt vs 35 Watt

Reasons to consider the Intel Celeron B810

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 37% better performance in PassMark - Single thread mark: 754 vs 551
Around 45% better performance in PassMark - CPU mark: 775 vs 536

Specifications (specs)
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	754 vs 551
PassMark - CPU mark	775 vs 536

Compare benchmarks

CPU 1: Intel Core 2 Duo L7300
CPU 2: Intel Celeron B810

PassMark - Single thread mark

CPU 1

CPU 2

551

754

PassMark - CPU mark

CPU 1

CPU 2

536

775

Name	Intel Core 2 Duo L7300	Intel Celeron B810
PassMark - Single thread mark	551	754
PassMark - CPU mark	536	775
Geekbench 4 - Single Core		308
Geekbench 4 - Multi-Core		584

Compare specifications (specs)

	Intel Core 2 Duo L7300	Intel Celeron B810
Essentials
Architecture codename	Merom	Sandy Bridge
Launch date	Q2'07	15 March 2011
Place in performance rating	2905	2906
Processor Number	L7300	B810
Series	Legacy Intel® Core™ Processors	Legacy Intel® Celeron® Processor
Status	Discontinued	Launched
Vertical segment	Mobile	Mobile
Launch price (MSRP)		$86
Performance
64 bit support
Base frequency	1.40 GHz	1.60 GHz
Bus Speed	800 MHz FSB
Die size	143 mm2	131 mm
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	100°C	100C
Number of cores	2	2
Transistor count	291 million	504 million
VID voltage range	0.975V-1.062V
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		2048 KB
Maximum frequency		1.6 GHz
Number of threads		2
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	37.5mmx37.5mm (rPGA988B)
Sockets supported	PBGA479	PGA988
Thermal Design Power (TDP)	17 Watt	35 Watt
Max number of CPUs in a configuration		1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
4G WiMAX Wireless
Flexible Display interface (FDI)
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® My WiFi technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Memory
Max memory channels		2
Maximum memory bandwidth		21.3 GB/s
Maximum memory size		16.6 GB
Supported memory types		DDR3 1066/1333
Graphics
Graphics base frequency		650 MHz
Graphics max dynamic frequency		950 MHz
Graphics max frequency		950 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported		2
SDVO
Wireless Display (WiDi) support
Peripherals
Max number of PCIe lanes		16
PCI Express revision		2.0
PCIe configurations		1x16, 2x8, 1x8 2x4