Intel Core 2 Duo T5250 vs Intel Atom E3805
Comparative analysis of Intel Core 2 Duo T5250 and Intel Atom E3805 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo T5250
- Around -350% higher maximum core temperature: 100°C vs -40°C to 110°C
- Around 51% better performance in PassMark - Single thread mark: 568 vs 376
- Around 37% better performance in PassMark - CPU mark: 556 vs 406
Specifications (specs) | |
Maximum core temperature | 100°C vs -40°C to 110°C |
Benchmarks | |
PassMark - Single thread mark | 568 vs 376 |
PassMark - CPU mark | 556 vs 406 |
Reasons to consider the Intel Atom E3805
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- 11.7x lower typical power consumption: 3 Watt vs 35 Watt
Manufacturing process technology | 22 nm vs 65 nm |
Thermal Design Power (TDP) | 3 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Core 2 Duo T5250
CPU 2: Intel Atom E3805
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core 2 Duo T5250 | Intel Atom E3805 |
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PassMark - Single thread mark | 568 | 376 |
PassMark - CPU mark | 556 | 406 |
Geekbench 4 - Single Core | 181 | |
Geekbench 4 - Multi-Core | 269 |
Compare specifications (specs)
Intel Core 2 Duo T5250 | Intel Atom E3805 | |
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Essentials |
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Architecture codename | Merom | Bay Trail |
Place in performance rating | 3163 | 3164 |
Processor Number | T5250 | E3805 |
Series | Legacy Intel® Core™ Processors | Intel® Atom™ Processor E Series |
Status | Discontinued | Launched |
Vertical segment | Mobile | Embedded |
Launch date | Q4'14 | |
Performance |
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64 bit support | ||
Base frequency | 1.50 GHz | 1.33 GHz |
Bus Speed | 667 MHz FSB | |
Die size | 143 mm2 | |
Manufacturing process technology | 65 nm | 22 nm |
Maximum core temperature | 100°C | -40°C to 110°C |
Number of cores | 2 | 2 |
Transistor count | 291 million | |
VID voltage range | 1.075V-1.250V | |
Number of threads | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 35mm x 35mm | 25mm x 27mm |
Sockets supported | PPGA478 | FCBGA1170 |
Thermal Design Power (TDP) | 35 Watt | 3 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
HD Audio | ||
Intel® AES New Instructions | ||
Intel® vPro™ Platform Eligibility | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Memory |
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Max memory channels | 1 | |
Maximum memory size | 8 GB | |
Supported memory types | DDR3L 1067 | |
Graphics |
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Intel® Quick Sync Video | ||
Peripherals |
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Integrated IDE | ||
Integrated LAN | ||
Max number of PCIe lanes | 4 | |
PCI Express revision | 2.0 | |
PCIe configurations | x4, x2, x1 | |
Total number of SATA ports | 2 | |
UART | ||
USB revision | 2.0, 3.0 |