Intel Core 2 Duo T5250 vs Intel Atom Z3530
Comparative analysis of Intel Core 2 Duo T5250 and Intel Atom Z3530 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo T5250
- Around 11% higher maximum core temperature: 100°C vs 90°C
- Around 54% better performance in PassMark - Single thread mark: 568 vs 368
| Specifications (specs) | |
| Maximum core temperature | 100°C vs 90°C |
| Benchmarks | |
| PassMark - Single thread mark | 568 vs 368 |
Reasons to consider the Intel Atom Z3530
- 2 more cores, run more applications at once: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- Around 2% better performance in PassMark - CPU mark: 565 vs 556
| Specifications (specs) | |
| Number of cores | 4 vs 2 |
| Manufacturing process technology | 22 nm vs 65 nm |
| Benchmarks | |
| PassMark - CPU mark | 565 vs 556 |
Compare benchmarks
CPU 1: Intel Core 2 Duo T5250
CPU 2: Intel Atom Z3530
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core 2 Duo T5250 | Intel Atom Z3530 |
|---|---|---|
| PassMark - Single thread mark | 568 | 368 |
| PassMark - CPU mark | 556 | 565 |
| Geekbench 4 - Single Core | 181 | |
| Geekbench 4 - Multi-Core | 269 |
Compare specifications (specs)
| Intel Core 2 Duo T5250 | Intel Atom Z3530 | |
|---|---|---|
Essentials |
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| Architecture codename | Merom | Moorefield |
| Place in performance rating | 3173 | 3176 |
| Processor Number | T5250 | Z3530 |
| Series | Legacy Intel® Core™ Processors | Intel® Atom™ Processor Z Series |
| Status | Discontinued | Launched |
| Vertical segment | Mobile | Mobile |
| Launch date | Q2'14 | |
Performance |
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| 64 bit support | ||
| Base frequency | 1.50 GHz | |
| Bus Speed | 667 MHz FSB | |
| Die size | 143 mm2 | |
| Manufacturing process technology | 65 nm | 22 nm |
| Maximum core temperature | 100°C | 90°C |
| Number of cores | 2 | 4 |
| Transistor count | 291 million | |
| VID voltage range | 1.075V-1.250V | AVID |
| Maximum frequency | 1.33 GHz | |
| Number of threads | 4 | |
Compatibility |
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| Low Halogen Options Available | ||
| Package Size | 35mm x 35mm | 14x14mm |
| Sockets supported | PPGA478 | FC-MB5T1064 |
| Thermal Design Power (TDP) | 35 Watt | |
| Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Intel® Secure Key technology | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| General-Purpose Input/Output (GPIO) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3, Intel® SSE4.1, Intel® SSE4.2 | |
| Intel® AES New Instructions | ||
| Physical Address Extensions (PAE) | 32-bit | |
| Smart Idle | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
Memory |
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| Max memory channels | 2 | |
| Maximum memory bandwidth | 12.8 GB/s | |
| Maximum memory size | 4 GB | |
| Supported memory types | LPDDR3 1600 | |
Graphics |
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| Graphics base frequency | 457 MHz | |
Graphics interfaces |
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| MIPI-DSI | ||
Peripherals |
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| Number of USB ports | 2 | |
| UART | ||
| USB revision | 2.0/3.0 | |