Intel Core 2 Duo T5450 vs Intel Celeron 807UE

Comparative analysis of Intel Core 2 Duo T5450 and Intel Celeron 807UE processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Duo T5450

Intel Celeron 807UE

Differences

Reasons to consider the Intel Core 2 Duo T5450

1 more cores, run more applications at once: 2 vs 1
Around 41% better performance in PassMark - Single thread mark: 592 vs 421
2.4x better performance in PassMark - CPU mark: 583 vs 241

Specifications (specs)
Number of cores	2 vs 1
Benchmarks
PassMark - Single thread mark	592 vs 421
PassMark - CPU mark	583 vs 241

Reasons to consider the Intel Celeron 807UE

A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
3.5x lower typical power consumption: 10 Watt vs 35 Watt

Manufacturing process technology	32 nm vs 65 nm
Thermal Design Power (TDP)	10 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Core 2 Duo T5450
CPU 2: Intel Celeron 807UE

PassMark - Single thread mark

CPU 1

CPU 2

592

421

PassMark - CPU mark

CPU 1

CPU 2

583

241

Name	Intel Core 2 Duo T5450	Intel Celeron 807UE
PassMark - Single thread mark	592	421
PassMark - CPU mark	583	241
Geekbench 4 - Single Core	203
Geekbench 4 - Multi-Core	359

Compare specifications (specs)

	Intel Core 2 Duo T5450	Intel Celeron 807UE
Essentials
Architecture codename	Merom	Sandy Bridge
Place in performance rating	3114	3115
Processor Number	T5450	807UE
Series	Legacy Intel® Core™ Processors	Legacy Intel® Celeron® Processor
Status	Discontinued	Launched
Vertical segment	Mobile	Embedded
Launch date		Q4'11
Performance
64 bit support
Base frequency	1.66 GHz	1.00 GHz
Bus Speed	667 MHz FSB
Die size	143 mm2
Manufacturing process technology	65 nm	32 nm
Maximum core temperature	100°C	100°C
Number of cores	2	1
Transistor count	291 million
VID voltage range	1.075V-1.250V
Number of threads		1
Compatibility
Low Halogen Options Available
Package Size	35mm x 35mm	31mm x 24mm (FCBGA1023)
Sockets supported	PPGA478	FCBGA1023
Thermal Design Power (TDP)	35 Watt	10 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
4G WiMAX Wireless
Idle States
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® My WiFi technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Memory
Max memory channels		1
Maximum memory size		4.88 GB
Supported memory types		DDR3 1066/1333
Graphics
Graphics base frequency		350 MHz
Graphics max dynamic frequency		800 MHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics