Intel Core 2 Duo T5450 vs Intel Pentium 4-M 1.70
Comparative analysis of Intel Core 2 Duo T5450 and Intel Pentium 4-M 1.70 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Duo T5450
- 1 more cores, run more applications at once: 2 vs 1
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 130 nm
- Around 39% better performance in PassMark - Single thread mark: 592 vs 426
- 3.4x better performance in PassMark - CPU mark: 583 vs 173
Specifications (specs) | |
Number of cores | 2 vs 1 |
Manufacturing process technology | 65 nm vs 130 nm |
Benchmarks | |
PassMark - Single thread mark | 592 vs 426 |
PassMark - CPU mark | 583 vs 173 |
Reasons to consider the Intel Pentium 4-M 1.70
- Around 17% lower typical power consumption: 30 Watt vs 35 Watt
Thermal Design Power (TDP) | 30 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Core 2 Duo T5450
CPU 2: Intel Pentium 4-M 1.70
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core 2 Duo T5450 | Intel Pentium 4-M 1.70 |
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PassMark - Single thread mark | 592 | 426 |
PassMark - CPU mark | 583 | 173 |
Geekbench 4 - Single Core | 203 | |
Geekbench 4 - Multi-Core | 359 |
Compare specifications (specs)
Intel Core 2 Duo T5450 | Intel Pentium 4-M 1.70 | |
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Essentials |
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Architecture codename | Merom | Northwood |
Place in performance rating | 3125 | 3124 |
Processor Number | T5450 | |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Mobile |
Launch date | March 2002 | |
Performance |
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64 bit support | ||
Base frequency | 1.66 GHz | 1.70 GHz |
Bus Speed | 667 MHz FSB | 400 MHz FSB |
Die size | 143 mm2 | 131 mm2 |
Manufacturing process technology | 65 nm | 130 nm |
Maximum core temperature | 100°C | 100°C |
Number of cores | 2 | 1 |
Transistor count | 291 million | 55 million |
VID voltage range | 1.075V-1.250V | 1.3V |
L1 cache | 8 KB | |
L2 cache | 512 KB | |
Maximum case temperature (TCase) | 100 °C | |
Maximum frequency | 1.7 GHz | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 35mm x 35mm | 35mm x 35mm |
Sockets supported | PPGA478 | PPGA478 |
Thermal Design Power (TDP) | 35 Watt | 30 Watt |
Max number of CPUs in a configuration | 1 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Idle States | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Memory |
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Supported memory types | DDR1, DDR2 |