Intel Core 2 Duo T5870 vs Intel Celeron M 540

Comparative analysis of Intel Core 2 Duo T5870 and Intel Celeron M 540 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Duo T5870

  • CPU is newer: launch date 1 year(s) 0 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • 1 more threads: 2 vs 1
  • Around 8% higher clock speed: 2 GHz vs 1.86 GHz
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 30% better performance in PassMark - CPU mark: 705 vs 542
Specifications (specs)
Launch date 1 October 2008 vs 1 October 2007
Number of cores 2 vs 1
Number of threads 2 vs 1
Maximum frequency 2 GHz vs 1.86 GHz
L2 cache 2048 KB vs 1 MB
Benchmarks
PassMark - CPU mark 705 vs 542

Reasons to consider the Intel Celeron M 540

  • Around 17% lower typical power consumption: 30 Watt vs 35 Watt
Thermal Design Power (TDP) 30 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Core 2 Duo T5870
CPU 2: Intel Celeron M 540

PassMark - CPU mark
CPU 1
CPU 2
705
542
Name Intel Core 2 Duo T5870 Intel Celeron M 540
PassMark - Single thread mark 744 0
PassMark - CPU mark 705 542
Geekbench 4 - Single Core 250
Geekbench 4 - Multi-Core 429

Compare specifications (specs)

Intel Core 2 Duo T5870 Intel Celeron M 540

Essentials

Architecture codename Merom Merom
Launch date 1 October 2008 1 October 2007
Place in performance rating 2978 3346
Processor Number T5870 540
Series Legacy Intel® Core™ Processors Legacy Intel® Celeron® Processor
Status Discontinued Discontinued
Vertical segment Mobile Mobile

Performance

64 bit support
Base frequency 2.00 GHz 1.86 GHz
Bus Speed 800 MHz FSB 533 MHz FSB
Die size 143 mm2 143 mm2
Front-side bus (FSB) 800 MHz 533 MHz
L2 cache 2048 KB 1 MB
Manufacturing process technology 65 nm 65 nm
Maximum core temperature 100°C 100°C
Maximum frequency 2 GHz 1.86 GHz
Number of cores 2 1
Number of threads 2 1
Transistor count 291 million 291 million
VID voltage range 1.075V-1.175V 0.95V-1.30V

Compatibility

Low Halogen Options Available
Package Size 35mm x 35mm 35mm x 35mm
Thermal Design Power (TDP) 35 Watt 30 Watt
Sockets supported PPGA478

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Idle States

Virtualization

Intel® Virtualization Technology (VT-x)