Intel Core 2 Extreme QX9770 vs Intel Core 2 Extreme QX9775
Comparative analysis of Intel Core 2 Extreme QX9770 and Intel Core 2 Extreme QX9775 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Extreme QX9770
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 10% lower typical power consumption: 136 Watt vs 150 Watt
Unlocked | Unlocked vs Locked |
L1 cache | 256 KB vs 128 KB |
Thermal Design Power (TDP) | 136 Watt vs 150 Watt |
Reasons to consider the Intel Core 2 Extreme QX9775
- Around 14% higher maximum core temperature: 63°C vs 55.5°C
Maximum core temperature | 63°C vs 55.5°C |
Compare benchmarks
CPU 1: Intel Core 2 Extreme QX9770
CPU 2: Intel Core 2 Extreme QX9775
Name | Intel Core 2 Extreme QX9770 | Intel Core 2 Extreme QX9775 |
---|---|---|
Geekbench 4 - Single Core | 2338 | |
Geekbench 4 - Multi-Core | 6682 |
Compare specifications (specs)
Intel Core 2 Extreme QX9770 | Intel Core 2 Extreme QX9775 | |
---|---|---|
Essentials |
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Architecture codename | Yorkfield | Yorkfield |
Launch date | March 2008 | March 2008 |
Place in performance rating | 812 | not rated |
Processor Number | QX9770 | QX9775 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.20 GHz | 3.20 GHz |
Bus Speed | 1600 MHz FSB | 1600 MHz FSB |
Die size | 214 mm2 | 214 mm2 |
L1 cache | 256 KB | 128 KB |
L2 cache | 12288 KB | 12288 KB |
Manufacturing process technology | 45 nm | 45 nm |
Maximum case temperature (TCase) | 55 °C | 63 °C |
Maximum core temperature | 55.5°C | 63°C |
Maximum frequency | 3.2 GHz | 3.2 GHz |
Number of cores | 4 | 4 |
Transistor count | 820 million | 820 million |
Unlocked | ||
VID voltage range | 0.8500V-1.3625V | 0.850V-1.3500V |
Memory |
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Supported memory types | DDR1, DDR2, DDR3 | DDR2 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | LGA775 | LGA771 |
Thermal Design Power (TDP) | 136 Watt | 150 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) |