Intel Core 2 Extreme QX9775 vs Intel Core Duo T2400

Comparative analysis of Intel Core 2 Extreme QX9775 and Intel Core Duo T2400 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Core 2 Extreme QX9775

Intel Core Duo T2400

Differences

Reasons to consider the Intel Core 2 Extreme QX9775

CPU is newer: launch date 2 year(s) 1 month(s) later
2 more cores, run more applications at once: 4 vs 2
Around 75% higher clock speed: 3.2 GHz vs 1.83 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
6x more L2 cache, more data can be stored in the L2 cache for quick access later

Launch date	March 2008 vs January 2006
Number of cores	4 vs 2
Maximum frequency	3.2 GHz vs 1.83 GHz
Manufacturing process technology	45 nm vs 65 nm
L2 cache	12288 KB vs 2048 KB

Reasons to consider the Intel Core Duo T2400

Around 59% higher maximum core temperature: 100°C vs 63°C
4.8x lower typical power consumption: 31 Watt vs 150 Watt

Maximum core temperature	100°C vs 63°C
Thermal Design Power (TDP)	31 Watt vs 150 Watt

Compare benchmarks

CPU 1: Intel Core 2 Extreme QX9775
CPU 2: Intel Core Duo T2400

Name	Intel Core 2 Extreme QX9775	Intel Core Duo T2400
PassMark - Single thread mark		527
PassMark - CPU mark		362

Compare specifications (specs)

	Intel Core 2 Extreme QX9775	Intel Core Duo T2400
Essentials
Architecture codename	Yorkfield	Yonah
Launch date	March 2008	January 2006
Place in performance rating	not rated	2962
Processor Number	QX9775	T2400
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Desktop	Mobile
Launch price (MSRP)		$16
Price now		$16
Value for money (0-100)		14.57
Performance
64 bit support
Base frequency	3.20 GHz	1.83 GHz
Bus Speed	1600 MHz FSB	667 MHz FSB
Die size	214 mm2	90 mm2
L1 cache	128 KB
L2 cache	12288 KB	2048 KB
Manufacturing process technology	45 nm	65 nm
Maximum case temperature (TCase)	63 °C
Maximum core temperature	63°C	100°C
Maximum frequency	3.2 GHz	1.83 GHz
Number of cores	4	2
Transistor count	820 million	151 million
VID voltage range	0.850V-1.3500V	1.1625V - 1.30V
Front-side bus (FSB)		667 MHz
Number of threads		2
Memory
Supported memory types	DDR2	DDR1
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	35mm x 35mm
Sockets supported	LGA771	PPGA478, PBGA479
Thermal Design Power (TDP)	150 Watt	31 Watt
Scenario Design Power (SDP)		0 W
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)