Intel Core 2 Extreme X6800 vs Intel Pentium G2100T

Comparative analysis of Intel Core 2 Extreme X6800 and Intel Pentium G2100T processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core 2 Extreme X6800

Intel Pentium G2100T

Differences

Reasons to consider the Intel Pentium G2100T

A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
2.1x lower typical power consumption: 35 Watt vs 75 Watt
Around 32% better performance in PassMark - Single thread mark: 1460 vs 1107
Around 54% better performance in PassMark - CPU mark: 1691 vs 1095

Specifications (specs)
Manufacturing process technology	22 nm vs 65 nm
Thermal Design Power (TDP)	35 Watt vs 75 Watt
Benchmarks
PassMark - Single thread mark	1460 vs 1107
PassMark - CPU mark	1691 vs 1095

Compare benchmarks

CPU 1: Intel Core 2 Extreme X6800
CPU 2: Intel Pentium G2100T

PassMark - Single thread mark

CPU 1

CPU 2

1107

1460

PassMark - CPU mark

CPU 1

CPU 2

1095

1691

Name	Intel Core 2 Extreme X6800	Intel Pentium G2100T
PassMark - Single thread mark	1107	1460
PassMark - CPU mark	1095	1691
Geekbench 4 - Single Core	1678
Geekbench 4 - Multi-Core	2644

Compare specifications (specs)

	Intel Core 2 Extreme X6800	Intel Pentium G2100T
Essentials
Architecture codename	Conroe	Ivy Bridge
Launch date	Q3'06	September 2012
Place in performance rating	1761	1766
Processor Number	X6800	G2100T
Series	Legacy Intel® Core™ Processors	Intel® Pentium® Processor G Series
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.93 GHz	2.60 GHz
Bus Speed	1066 MHz FSB	5 GT/s DMI
Die size	143 mm2	94 mm
Manufacturing process technology	65 nm	22 nm
Maximum core temperature	60.4°C
Number of cores	2	2
Transistor count	291 million
VID voltage range	0.8500V-1.5V
L1 cache		64 KB (per core)
L2 cache		256 KB (per core)
L3 cache		3072 KB (shared)
Maximum case temperature (TCase)		65 °C
Maximum frequency		2.6 GHz
Number of threads		2
Compatibility
Low Halogen Options Available
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	PLGA775	FCLGA1155
Thermal Design Power (TDP)	75 Watt	35 Watt
Max number of CPUs in a configuration		1
Thermal Solution		2011A
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Anti-Theft technology
Intel® Secure Key technology
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2
Intel® My WiFi technology
Intel® Optane™ Memory Supported
Intel® vPro™ Platform Eligibility
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Memory
ECC memory support
Max memory channels		2
Maximum memory bandwidth		25.6 GB/s
Maximum memory size		32 GB
Supported memory types		DDR3 1333/1600
Graphics
Graphics base frequency		650 MHz
Graphics max dynamic frequency		1.05 GHz
Graphics max frequency		1.05 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics
Graphics interfaces
Number of displays supported		3
Wireless Display (WiDi) support
Peripherals
PCI Express revision		2.0
PCIe configurations		up to 1x16, 2x8, 1x8 & 2x4