Intel Core 2 Quad Q8400s vs Intel Atom Z510P

Comparative analysis of Intel Core 2 Quad Q8400s and Intel Atom Z510P processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.

 

Differences

Reasons to consider the Intel Core 2 Quad Q8400s

  • CPU is newer: launch date 1 month(s) later
  • 3 more cores, run more applications at once: 4 vs 1
  • Around 143% higher clock speed: 2.67 GHz vs 1.1 GHz
  • 4x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 8x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date April 2009 vs March 2009
Number of cores 4 vs 1
Maximum frequency 2.67 GHz vs 1.1 GHz
L1 cache 256 KB vs 64 KB (per core)
L2 cache 4096 KB vs 512 KB (per core)

Reasons to consider the Intel Atom Z510P

  • Around 18% higher maximum core temperature: 90°C vs 76.3°C
  • 32.5x lower typical power consumption: 2.2 Watt vs 65 Watt
Maximum core temperature 90°C vs 76.3°C
Thermal Design Power (TDP) 2.2 Watt vs 65 Watt

Compare specifications (specs)

Intel Core 2 Quad Q8400s Intel Atom Z510P

Essentials

Architecture codename Yorkfield Silverthorne
Launch date April 2009 March 2009
Place in performance rating not rated not rated
Processor Number Q8400S Z510P
Series Legacy Intel® Core™ Processors Legacy Intel Atom® Processors
Status Discontinued Discontinued
Vertical segment Desktop Mobile

Performance

64 bit support
Base frequency 2.66 GHz 1.10 GHz
Bus Speed 1333 MHz FSB 400 MHz FSB
Die size 164 mm2 26 mm2
L1 cache 256 KB 64 KB (per core)
L2 cache 4096 KB 512 KB (per core)
Manufacturing process technology 45 nm 45 nm
Maximum case temperature (TCase) 76 °C
Maximum core temperature 76.3°C 90°C
Maximum frequency 2.67 GHz 1.1 GHz
Number of cores 4 1
Transistor count 456 million 47 million
VID voltage range 0.8500V-1.3625V 0.8V-1.1V

Memory

Supported memory types DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm 22mm x 22mm
Sockets supported LGA775 FCBGA437
Thermal Design Power (TDP) 65 Watt 2.2 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
FSB parity
Instruction set extensions Intel® SSE2, Intel® SSE3, Intel® SSSE3

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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