Intel Core 2 Quad Q8400s vs Intel Atom Z510P
Comparative analysis of Intel Core 2 Quad Q8400s and Intel Atom Z510P processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Core 2 Quad Q8400s
- CPU is newer: launch date 1 month(s) later
- 3 more cores, run more applications at once: 4 vs 1
- Around 143% higher clock speed: 2.67 GHz vs 1.1 GHz
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
| Launch date | April 2009 vs March 2009 |
| Number of cores | 4 vs 1 |
| Maximum frequency | 2.67 GHz vs 1.1 GHz |
| L1 cache | 256 KB vs 64 KB (per core) |
| L2 cache | 4096 KB vs 512 KB (per core) |
Reasons to consider the Intel Atom Z510P
- Around 18% higher maximum core temperature: 90°C vs 76.3°C
- 32.5x lower typical power consumption: 2.2 Watt vs 65 Watt
| Maximum core temperature | 90°C vs 76.3°C |
| Thermal Design Power (TDP) | 2.2 Watt vs 65 Watt |
Compare specifications (specs)
| Intel Core 2 Quad Q8400s | Intel Atom Z510P | |
|---|---|---|
Essentials |
||
| Architecture codename | Yorkfield | Silverthorne |
| Launch date | April 2009 | March 2009 |
| Place in performance rating | not rated | not rated |
| Processor Number | Q8400S | Z510P |
| Series | Legacy Intel® Core™ Processors | Legacy Intel Atom® Processors |
| Status | Discontinued | Discontinued |
| Vertical segment | Desktop | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.66 GHz | 1.10 GHz |
| Bus Speed | 1333 MHz FSB | 400 MHz FSB |
| Die size | 164 mm2 | 26 mm2 |
| L1 cache | 256 KB | 64 KB (per core) |
| L2 cache | 4096 KB | 512 KB (per core) |
| Manufacturing process technology | 45 nm | 45 nm |
| Maximum case temperature (TCase) | 76 °C | |
| Maximum core temperature | 76.3°C | 90°C |
| Maximum frequency | 2.67 GHz | 1.1 GHz |
| Number of cores | 4 | 1 |
| Transistor count | 456 million | 47 million |
| VID voltage range | 0.8500V-1.3625V | 0.8V-1.1V |
Memory |
||
| Supported memory types | DDR1, DDR2, DDR3 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | 22mm x 22mm |
| Sockets supported | LGA775 | FCBGA437 |
| Thermal Design Power (TDP) | 65 Watt | 2.2 Watt |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| FSB parity | ||
| Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||