Intel Core 2 Quad Q8400s vs Intel Atom Z510P
Comparative analysis of Intel Core 2 Quad Q8400s and Intel Atom Z510P processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Core 2 Quad Q8400s
- CPU is newer: launch date 1 month(s) later
- 3 more cores, run more applications at once: 4 vs 1
- Around 143% higher clock speed: 2.67 GHz vs 1.1 GHz
- 4x more L1 cache, more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date | April 2009 vs March 2009 |
Number of cores | 4 vs 1 |
Maximum frequency | 2.67 GHz vs 1.1 GHz |
L1 cache | 256 KB vs 64 KB (per core) |
L2 cache | 4096 KB vs 512 KB (per core) |
Reasons to consider the Intel Atom Z510P
- Around 18% higher maximum core temperature: 90°C vs 76.3°C
- 32.5x lower typical power consumption: 2.2 Watt vs 65 Watt
Maximum core temperature | 90°C vs 76.3°C |
Thermal Design Power (TDP) | 2.2 Watt vs 65 Watt |
Compare specifications (specs)
Intel Core 2 Quad Q8400s | Intel Atom Z510P | |
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Essentials |
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Architecture codename | Yorkfield | Silverthorne |
Launch date | April 2009 | March 2009 |
Place in performance rating | not rated | not rated |
Processor Number | Q8400S | Z510P |
Series | Legacy Intel® Core™ Processors | Legacy Intel Atom® Processors |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Mobile |
Performance |
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64 bit support | ||
Base frequency | 2.66 GHz | 1.10 GHz |
Bus Speed | 1333 MHz FSB | 400 MHz FSB |
Die size | 164 mm2 | 26 mm2 |
L1 cache | 256 KB | 64 KB (per core) |
L2 cache | 4096 KB | 512 KB (per core) |
Manufacturing process technology | 45 nm | 45 nm |
Maximum case temperature (TCase) | 76 °C | |
Maximum core temperature | 76.3°C | 90°C |
Maximum frequency | 2.67 GHz | 1.1 GHz |
Number of cores | 4 | 1 |
Transistor count | 456 million | 47 million |
VID voltage range | 0.8500V-1.3625V | 0.8V-1.1V |
Memory |
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Supported memory types | DDR1, DDR2, DDR3 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 22mm x 22mm |
Sockets supported | LGA775 | FCBGA437 |
Thermal Design Power (TDP) | 65 Watt | 2.2 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
FSB parity | ||
Instruction set extensions | Intel® SSE2, Intel® SSE3, Intel® SSSE3 | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |