Intel Core 2 Quad Q8400s vs Intel Core 2 Duo SP9600

Comparative analysis of Intel Core 2 Quad Q8400s and Intel Core 2 Duo SP9600 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.

 

Differences

Reasons to consider the Intel Core 2 Quad Q8400s

  • CPU is newer: launch date 1 month(s) later
  • 2 more cores, run more applications at once: 4 vs 2
  • Around 6% higher clock speed: 2.67 GHz vs 2.53 GHz
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
Launch date April 2009 vs 1 March 2009
Number of cores 4 vs 2
Maximum frequency 2.67 GHz vs 2.53 GHz
L1 cache 256 KB vs 128 KB

Reasons to consider the Intel Core 2 Duo SP9600

  • Around 38% higher maximum core temperature: 105°C vs 76.3°C
  • Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
  • 2.6x lower typical power consumption: 25 Watt vs 65 Watt
Maximum core temperature 105°C vs 76.3°C
L2 cache 6134 KB vs 4096 KB
Thermal Design Power (TDP) 25 Watt vs 65 Watt

Compare specifications (specs)

Intel Core 2 Quad Q8400s Intel Core 2 Duo SP9600

Essentials

Architecture codename Yorkfield Penryn
Launch date April 2009 1 March 2009
Place in performance rating not rated not rated
Processor Number Q8400S SP9600
Series Legacy Intel® Core™ Processors Legacy Intel® Core™ Processors
Status Discontinued Discontinued
Vertical segment Desktop Mobile
Launch price (MSRP) $316

Performance

64 bit support
Base frequency 2.66 GHz 2.53 GHz
Bus Speed 1333 MHz FSB 1066 MHz FSB
Die size 164 mm2 107 mm2
L1 cache 256 KB 128 KB
L2 cache 4096 KB 6134 KB
Manufacturing process technology 45 nm 45 nm
Maximum case temperature (TCase) 76 °C
Maximum core temperature 76.3°C 105°C
Maximum frequency 2.67 GHz 2.53 GHz
Number of cores 4 2
Transistor count 456 million 410 million
VID voltage range 0.8500V-1.3625V 1.050V-1.150V
Front-side bus (FSB) 1066 MHz
Number of threads 2

Memory

Supported memory types DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm 22mm x 22mm
Sockets supported LGA775 BGA956
Thermal Design Power (TDP) 65 Watt 25 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
FSB parity

Virtualization

Intel® Virtualization Technology (VT-x)

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