Intel Core 2 Quad Q9505S vs Intel Core 2 Duo E6850
Comparative analysis of Intel Core 2 Quad Q9505S and Intel Core 2 Duo E6850 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Core 2 Quad Q9505S
- 2 more cores, run more applications at once: 4 vs 2
- Around 6% higher maximum core temperature: 76.3°C vs 72°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
Number of cores | 4 vs 2 |
Maximum core temperature | 76.3°C vs 72°C |
Manufacturing process technology | 45 nm vs 65 nm |
Compare benchmarks
CPU 1: Intel Core 2 Quad Q9505S
CPU 2: Intel Core 2 Duo E6850
Name | Intel Core 2 Quad Q9505S | Intel Core 2 Duo E6850 |
---|---|---|
PassMark - Single thread mark | 1187 | |
PassMark - CPU mark | 1147 | |
Geekbench 4 - Single Core | 401 | |
Geekbench 4 - Multi-Core | 702 |
Compare specifications (specs)
Intel Core 2 Quad Q9505S | Intel Core 2 Duo E6850 | |
---|---|---|
Essentials |
||
Architecture codename | Yorkfield | Conroe |
Launch date | Q3'09 | Q3'07 |
Place in performance rating | not rated | 2541 |
Processor Number | Q9505S | E6850 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
||
64 bit support | ||
Base frequency | 2.83 GHz | 3.00 GHz |
Bus Speed | 1333 MHz FSB | 1333 MHz FSB |
Die size | 164 mm2 | 143 mm2 |
Manufacturing process technology | 45 nm | 65 nm |
Maximum core temperature | 76.3°C | 72°C |
Number of cores | 4 | 2 |
Transistor count | 456 million | 291 million |
VID voltage range | 0.8500V-1.3625V | 0.8500V-1.5V |
Compatibility |
||
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
Sockets supported | LGA775 | PLGA775 |
Thermal Design Power (TDP) | 65 Watt | 65 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
FSB parity | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |