Intel Core 2 Solo SU3300 vs Intel Celeron 450

Comparative analysis of Intel Core 2 Solo SU3300 and Intel Celeron 450 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Core 2 Solo SU3300

  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
  • 6x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 5.8x lower typical power consumption: 5.5 Watt vs 35 Watt
Manufacturing process technology 45 nm vs 65 nm
L2 cache 3 MB vs 512 KB
Thermal Design Power (TDP) 5.5 Watt vs 35 Watt

Reasons to consider the Intel Celeron 450

  • Around 83% higher clock speed: 2.2 GHz vs 1.2 GHz
Maximum frequency 2.2 GHz vs 1.2 GHz

Compare benchmarks

CPU 1: Intel Core 2 Solo SU3300
CPU 2: Intel Celeron 450

Name Intel Core 2 Solo SU3300 Intel Celeron 450
PassMark - Single thread mark 763
PassMark - CPU mark 433
Geekbench 4 - Single Core 963
Geekbench 4 - Multi-Core 971

Compare specifications (specs)

Intel Core 2 Solo SU3300 Intel Celeron 450

Essentials

Architecture codename Penryn Conroe
Launch date 20 August 2008 August 2008
Launch price (MSRP) $262
Place in performance rating not rated 2466
Series Intel Core 2 Solo Legacy Intel® Celeron® Processor
Vertical segment Laptop Desktop
Price now $29.99
Processor Number 450
Status Discontinued
Value for money (0-100) 6.14

Performance

64 bit support
Die size 107 mm 77 mm2
Front-side bus (FSB) 800 MHz
L2 cache 3 MB 512 KB
Manufacturing process technology 45 nm 65 nm
Maximum frequency 1.2 GHz 2.2 GHz
Number of cores 1 1
Number of threads 1
Transistor count 410 Million 105 million
Base frequency 2.20 GHz
Bus Speed 800 MHz FSB
L1 cache 64 KB
Maximum core temperature 60.4°C
VID voltage range 1.0000V-1.3375V

Compatibility

Sockets supported BGA956 LGA775
Thermal Design Power (TDP) 5.5 Watt 35 Watt
Low Halogen Options Available
Max number of CPUs in a configuration 1
Package Size 37.5mm x 37.5mm

Memory

Supported memory types DDR1, DDR2, DDR3

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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