Intel Core 2 Solo ULV SU3300 vs Intel Celeron M 570
Comparative analysis of Intel Core 2 Solo ULV SU3300 and Intel Celeron M 570 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Core 2 Solo ULV SU3300
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
- 5.2x lower typical power consumption: 5.5 Watt vs 31 Watt
| Manufacturing process technology | 45 nm vs 65 nm |
| L2 cache | 3072 KB vs 1 MB |
| Thermal Design Power (TDP) | 5.5 Watt vs 31 Watt |
Reasons to consider the Intel Celeron M 570
- Around 88% higher clock speed: 2.26 GHz vs 1.2 GHz
| Maximum frequency | 2.26 GHz vs 1.2 GHz |
Compare specifications (specs)
| Intel Core 2 Solo ULV SU3300 | Intel Celeron M 570 | |
|---|---|---|
Essentials |
||
| Architecture codename | Penryn | Merom |
| Launch date | May 2008 | 30 April 2008 |
| Place in performance rating | not rated | not rated |
| Processor Number | SU3300 | 570 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Celeron® Processor |
| Status | Discontinued | Discontinued |
| Vertical segment | Mobile | Mobile |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.20 GHz | 2.26 GHz |
| Bus Speed | 800 MHz FSB | 533 MHz FSB |
| Die size | 107 mm2 | 143 mm2 |
| L1 cache | 64 KB | |
| L2 cache | 3072 KB | 1 MB |
| Manufacturing process technology | 45 nm | 65 nm |
| Maximum core temperature | 100°C | |
| Maximum frequency | 1.2 GHz | 2.26 GHz |
| Number of cores | 1 | 1 |
| Transistor count | 410 million | 291 million |
| VID voltage range | 1.050V-1.150V | |
| Front-side bus (FSB) | 533 MHz | |
| Number of threads | 1 | |
Memory |
||
| Supported memory types | DDR1 | |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 22mm x 22mm | 35mm x 35mm |
| Sockets supported | BGA956 | PPGA478 |
| Thermal Design Power (TDP) | 5.5 Watt | 31 Watt |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
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