Intel Core i3-10100F vs Intel Core 2 Duo E8400
Comparative analysis of Intel Core i3-10100F and Intel Core 2 Duo E8400 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-10100F
- 2 more cores, run more applications at once: 4 vs 2
- Around 43% higher clock speed: 4.30 GHz vs 3 GHz
- Around 38% higher maximum core temperature: 100°C vs 72.4°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.1x better performance in PassMark - Single thread mark: 2586 vs 1234
- 7.2x better performance in PassMark - CPU mark: 8715 vs 1210
- Around 32% better performance in 3DMark Fire Strike - Physics Score: 3176 vs 2400
| Specifications (specs) | |
| Number of cores | 4 vs 2 |
| Maximum frequency | 4.30 GHz vs 3 GHz |
| Maximum core temperature | 100°C vs 72.4°C |
| Manufacturing process technology | 14 nm vs 45 nm |
| L1 cache | 256 KB vs 128 KB |
| Benchmarks | |
| PassMark - Single thread mark | 2586 vs 1234 |
| PassMark - CPU mark | 8715 vs 1210 |
| 3DMark Fire Strike - Physics Score | 3176 vs 2400 |
Reasons to consider the Intel Core 2 Duo E8400
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
| L2 cache | 6144 KB vs 1 MB |
Compare benchmarks
CPU 1: Intel Core i3-10100F
CPU 2: Intel Core 2 Duo E8400
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| 3DMark Fire Strike - Physics Score |
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| Name | Intel Core i3-10100F | Intel Core 2 Duo E8400 |
|---|---|---|
| PassMark - Single thread mark | 2586 | 1234 |
| PassMark - CPU mark | 8715 | 1210 |
| 3DMark Fire Strike - Physics Score | 3176 | 2400 |
| Geekbench 4 - Single Core | 422 | |
| Geekbench 4 - Multi-Core | 738 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.33 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 26.311 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.099 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.68 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 2.408 |
Compare specifications (specs)
| Intel Core i3-10100F | Intel Core 2 Duo E8400 | |
|---|---|---|
Essentials |
||
| Architecture codename | Comet Lake | Wolfdale |
| Launch date | Q4'20 | January 2008 |
| Launch price (MSRP) | $79 - $97 | |
| Place in performance rating | 1188 | 2981 |
| Processor Number | i3-10100F | E8400 |
| Series | 10th Generation Intel Core i3 Processors | Legacy Intel® Core™ Processors |
| Status | Launched | Discontinued |
| Vertical segment | Desktop | Desktop |
| Price now | $129.95 | |
| Value for money (0-100) | 4.87 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 3.60 GHz | 3.00 GHz |
| Bus Speed | 8 GT/s | 1333 MHz FSB |
| L1 cache | 256 KB | 128 KB |
| L2 cache | 1 MB | 6144 KB |
| L3 cache | 6 MB | |
| Manufacturing process technology | 14 nm | 45 nm |
| Maximum core temperature | 100°C | 72.4°C |
| Maximum frequency | 4.30 GHz | 3 GHz |
| Number of cores | 4 | 2 |
| Number of threads | 8 | |
| Die size | 107 mm2 | |
| Maximum case temperature (TCase) | 72 °C | |
| Transistor count | 410 million | |
| VID voltage range | 0.8500V-1.3625V | |
Memory |
||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 41.6 GB/s | |
| Maximum memory size | 128 GB | |
| Supported memory types | DDR4-2666 | DDR1, DDR2, DDR3 |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| Sockets supported | FCLGA1200 | LGA775 |
| Thermal Design Power (TDP) | 65 Watt | 65 Watt |
| Thermal Solution | PCG 2015C | |
| Low Halogen Options Available | ||
Peripherals |
||
| Max number of PCIe lanes | 16 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® Thermal Velocity Boost | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| FSB parity | ||
| Intel® Demand Based Switching | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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