Intel Core i3-2330M vs Intel Pentium M 1.40

Comparative analysis of Intel Core i3-2330M and Intel Pentium M 1.40 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Core i3-2330M

Intel Pentium M 1.40

Differences

Reasons to consider the Intel Core i3-2330M

CPU is newer: launch date 8 year(s) 2 month(s) later
1 more cores, run more applications at once: 2 vs 1
Around 57% higher clock speed: 2.2 GHz vs 1.4 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 130 nm
8x more L1 cache, more data can be stored in the L1 cache for quick access later
2.3x better performance in PassMark - Single thread mark: 964 vs 425
3.6x better performance in PassMark - CPU mark: 1228 vs 345

Specifications (specs)
Launch date	15 May 2011 vs March 2003
Number of cores	2 vs 1
Maximum frequency	2.2 GHz vs 1.4 GHz
Manufacturing process technology	32 nm vs 130 nm
L1 cache	128 KB vs 16 KB
Benchmarks
PassMark - Single thread mark	964 vs 425
PassMark - CPU mark	1228 vs 345

Reasons to consider the Intel Pentium M 1.40

Around 18% higher maximum core temperature: 100°C vs 85C (PGA); 100C (BGA)
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 59% lower typical power consumption: 22 Watt vs 35 Watt

Maximum core temperature	100°C vs 85C (PGA); 100C (BGA)
L2 cache	1024 KB vs 512 KB
Thermal Design Power (TDP)	22 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Core i3-2330M
CPU 2: Intel Pentium M 1.40

PassMark - Single thread mark

CPU 1

CPU 2

964

425

PassMark - CPU mark

CPU 1

CPU 2

1228

345

Name	Intel Core i3-2330M	Intel Pentium M 1.40
PassMark - Single thread mark	964	425
PassMark - CPU mark	1228	345
Geekbench 4 - Single Core	371
Geekbench 4 - Multi-Core	816
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	1.346
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	24.484
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.176
CompuBench 1.5 Desktop - Video Composition (Frames/s)	0.618
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	1.487

Compare specifications (specs)

	Intel Core i3-2330M	Intel Pentium M 1.40
Essentials
Architecture codename	Sandy Bridge	Banias
Launch date	15 May 2011	March 2003
Launch price (MSRP)	$19
Place in performance rating	3098	3105
Price now	$170.20
Processor Number	i3-2330M
Series	Legacy Intel® Core™ Processors	Legacy Intel® Pentium® Processor
Status	Launched	Discontinued
Value for money (0-100)	4.36
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	2.20 GHz	1.40 GHz
Bus Speed	5 GT/s DMI	400 MHz FSB
Die size	149 mm	83 mm2
L1 cache	128 KB	16 KB
L2 cache	512 KB	1024 KB
L3 cache	3072 KB
Manufacturing process technology	32 nm	130 nm
Maximum core temperature	85C (PGA); 100C (BGA)	100°C
Maximum frequency	2.2 GHz	1.4 GHz
Number of cores	2	1
Number of threads	4
Transistor count	624 Million	77 million
VID voltage range		0.956V-1.388V
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	16 GB
Supported memory types	DDR3 1066/1333	DDR1, DDR2
Graphics
Device ID	0x116
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.10 GHz
Graphics max frequency	1.1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel® HD Graphics 3000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm (rPGA988B); 31mm x 24mm (BGA1023)
Sockets supported	FCBGA1023, PPGA988	PPGA478, H-PBGA479
Thermal Design Power (TDP)	35 Watt	22 Watt
Scenario Design Power (SDP)		0 W
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity
Physical Address Extensions (PAE)		32-bit
Virtualization
AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)