Intel Core i3-350M vs Intel Core 2 Duo T8300
Comparative analysis of Intel Core i3-350M and Intel Core 2 Duo T8300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-350M
- CPU is newer: launch date 2 year(s) 0 month(s) later
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 20% better performance in PassMark - CPU mark: 1083 vs 902
- Around 1% better performance in Geekbench 4 - Single Core: 324 vs 321
- Around 35% better performance in Geekbench 4 - Multi-Core: 720 vs 535
- Around 3% better performance in CompuBench 1.5 Desktop - Face Detection (mPixels/s): 0.268 vs 0.259
- Around 28% better performance in CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s): 20.244 vs 15.787
- Around 33% better performance in CompuBench 1.5 Desktop - T-Rex (Frames/s): 0.1 vs 0.075
- Around 22% better performance in CompuBench 1.5 Desktop - Video Composition (Frames/s): 0.585 vs 0.479
| Specifications (specs) | |
| Launch date | 10 January 2010 vs 10 January 2008 |
| Number of threads | 4 vs 2 |
| Manufacturing process technology | 32 nm vs 45 nm |
| Benchmarks | |
| PassMark - CPU mark | 1083 vs 902 |
| Geekbench 4 - Single Core | 324 vs 321 |
| Geekbench 4 - Multi-Core | 720 vs 535 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.268 vs 0.259 |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 20.244 vs 15.787 |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.1 vs 0.075 |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.585 vs 0.479 |
Reasons to consider the Intel Core 2 Duo T8300
- Around 6% higher clock speed: 2.4 GHz vs 2.26 GHz
- Around 17% higher maximum core temperature: 105°C vs 90°C for rPGA, 105°C for BGA
- 6x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 11% better performance in PassMark - Single thread mark: 970 vs 874
- Around 13% better performance in CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s): 1.875 vs 1.66
| Specifications (specs) | |
| Maximum frequency | 2.4 GHz vs 2.26 GHz |
| Maximum core temperature | 105°C vs 90°C for rPGA, 105°C for BGA |
| L2 cache | 3072 KB vs 512 KB |
| Benchmarks | |
| PassMark - Single thread mark | 970 vs 874 |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.875 vs 1.66 |
Compare benchmarks
CPU 1: Intel Core i3-350M
CPU 2: Intel Core 2 Duo T8300
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| CompuBench 1.5 Desktop - Face Detection (mPixels/s) |
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| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) |
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| CompuBench 1.5 Desktop - T-Rex (Frames/s) |
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| CompuBench 1.5 Desktop - Video Composition (Frames/s) |
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| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) |
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| Name | Intel Core i3-350M | Intel Core 2 Duo T8300 |
|---|---|---|
| PassMark - Single thread mark | 874 | 970 |
| PassMark - CPU mark | 1083 | 902 |
| Geekbench 4 - Single Core | 324 | 321 |
| Geekbench 4 - Multi-Core | 720 | 535 |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 0.268 | 0.259 |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 20.244 | 15.787 |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.1 | 0.075 |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 0.585 | 0.479 |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 1.66 | 1.875 |
Compare specifications (specs)
| Intel Core i3-350M | Intel Core 2 Duo T8300 | |
|---|---|---|
Essentials |
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| Architecture codename | Arrandale | Penryn |
| Launch date | 10 January 2010 | 10 January 2008 |
| Launch price (MSRP) | $130 | $241 |
| Place in performance rating | 3202 | 3206 |
| Price now | $44.05 | $213.99 |
| Processor Number | i3-350M | T8300 |
| Series | Legacy Intel® Core™ Processors | Legacy Intel® Core™ Processors |
| Status | Discontinued | Discontinued |
| Value for money (0-100) | 12.65 | 2.03 |
| Vertical segment | Mobile | Mobile |
Performance |
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| 64 bit support | ||
| Base frequency | 2.26 GHz | 2.40 GHz |
| Bus Speed | 2.5 GT/s DMI | 800 MHz FSB |
| Die size | 81 mm2 | 107 mm2 |
| Front-side bus (FSB) | 2500 MHz | 800 MHz |
| L1 cache | 64 KB (per core) | |
| L2 cache | 512 KB | 3072 KB |
| L3 cache | 3072 KB | |
| Manufacturing process technology | 32 nm | 45 nm |
| Maximum core temperature | 90°C for rPGA, 105°C for BGA | 105°C |
| Maximum frequency | 2.26 GHz | 2.4 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 2 |
| Transistor count | 382 million | 410 million |
| VID voltage range | 1.000V-1.250V | |
Memory |
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| Max memory channels | 2 | |
| Maximum memory bandwidth | 17.1 GB/s | |
| Maximum memory size | 8 GB | |
| Supported memory types | DDR3 800/1066 | |
Graphics |
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| Graphics base frequency | 500 MHz | |
| Graphics max dynamic frequency | 667 MHz | |
| Graphics max frequency | 667 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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| Number of displays supported | 2 | |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | rPGA 37.5mmx 37.5mm, BGA 34mmx28mm | 35mm x 35mm |
| Sockets supported | BGA1288, PGA988 | PGA478, BGA479 |
| Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 2.0 | |
| PCIe configurations | 1x16 | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Physical Address Extensions (PAE) | 36-bit | |
| Thermal Monitoring | ||
| FSB parity | ||
| Intel® Demand Based Switching | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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