Intel Core i3-4170 vs Intel Core 2 Extreme QX6850
Comparative analysis of Intel Core i3-4170 and Intel Core 2 Extreme QX6850 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-4170
- Around 12% higher maximum core temperature: 72°C vs 64.5°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
- 2.4x lower typical power consumption: 54 Watt vs 130 Watt
Maximum core temperature | 72°C vs 64.5°C |
Manufacturing process technology | 22 nm vs 65 nm |
Thermal Design Power (TDP) | 54 Watt vs 130 Watt |
Reasons to consider the Intel Core 2 Extreme QX6850
- 2 more cores, run more applications at once: 4 vs 2
Number of cores | 4 vs 2 |
Compare benchmarks
CPU 1: Intel Core i3-4170
CPU 2: Intel Core 2 Extreme QX6850
Name | Intel Core i3-4170 | Intel Core 2 Extreme QX6850 |
---|---|---|
PassMark - Single thread mark | 2052 | |
PassMark - CPU mark | 3592 | |
Geekbench 4 - Single Core | 823 | |
Geekbench 4 - Multi-Core | 1743 | |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.614 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 46.136 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.297 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.273 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 3.137 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 870 | |
GFXBench 4.0 - Manhattan (Frames) | 2169 | |
GFXBench 4.0 - T-Rex (Frames) | 3711 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 870 | |
GFXBench 4.0 - Manhattan (Fps) | 2169 | |
GFXBench 4.0 - T-Rex (Fps) | 3711 |
Compare specifications (specs)
Intel Core i3-4170 | Intel Core 2 Extreme QX6850 | |
---|---|---|
Essentials |
||
Architecture codename | Haswell | Kentsfield |
Launch date | Q1'15 | Q3'07 |
Place in performance rating | 1938 | not rated |
Processor Number | i3-4170 | QX6850 |
Series | 4th Generation Intel® Core™ i3 Processors | Legacy Intel® Core™ Processors |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
||
64 bit support | ||
Base frequency | 3.70 GHz | 3.00 GHz |
Bus Speed | 5 GT/s DMI2 | 1333 MHz FSB |
Manufacturing process technology | 22 nm | 65 nm |
Maximum core temperature | 72°C | 64.5°C |
Number of cores | 2 | 4 |
Number of threads | 4 | |
Die size | 286 mm2 | |
Transistor count | 582 million | |
VID voltage range | 0.8500V-1.500V | |
Memory |
||
Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V | |
Graphics |
||
Device ID | 0x41E | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® HD Graphics 4400 | |
Graphics interfaces |
||
DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Graphics image quality |
||
Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over eDP | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
||
DirectX | 11.1/12 | |
OpenGL | 4.3 | |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1150 | LGA775 |
Thermal Design Power (TDP) | 54 Watt | 130 Watt |
Thermal Solution | PCG 2013C | |
Peripherals |
||
Max number of PCIe lanes | 16 | |
PCI Express revision | Up to 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
FSB parity | ||
Intel® Demand Based Switching | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |