Intel Core i3-4330TE vs AMD E2-9000
Comparative analysis of Intel Core i3-4330TE and AMD E2-9000 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-4330TE
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 28 nm
- Around 63% better performance in PassMark - Single thread mark: 1327 vs 814
- 2.1x better performance in PassMark - CPU mark: 2022 vs 950
| Specifications (specs) | |
| Number of threads | 4 vs 2 |
| Manufacturing process technology | 22 nm vs 28 nm |
| Benchmarks | |
| PassMark - Single thread mark | 1327 vs 814 |
| PassMark - CPU mark | 2022 vs 950 |
Reasons to consider the AMD E2-9000
- Around 25% higher maximum core temperature: 90 °C vs 72°C
- 3.5x lower typical power consumption: 10 Watt vs 35 Watt
| Maximum core temperature | 90 °C vs 72°C |
| Thermal Design Power (TDP) | 10 Watt vs 35 Watt |
Compare benchmarks
CPU 1: Intel Core i3-4330TE
CPU 2: AMD E2-9000
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i3-4330TE | AMD E2-9000 |
|---|---|---|
| PassMark - Single thread mark | 1327 | 814 |
| PassMark - CPU mark | 2022 | 950 |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 514 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 514 | |
| GFXBench 4.0 - Manhattan (Frames) | 1227 | |
| GFXBench 4.0 - Manhattan (Fps) | 1227 | |
| GFXBench 4.0 - T-Rex (Frames) | 3313 | |
| GFXBench 4.0 - T-Rex (Fps) | 3313 |
Compare specifications (specs)
| Intel Core i3-4330TE | AMD E2-9000 | |
|---|---|---|
Essentials |
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| Architecture codename | Haswell | Stoney Ridge |
| Launch date | Q3'13 | 1 June 2016 |
| Place in performance rating | 1904 | 1897 |
| Processor Number | i3-4330TE | |
| Series | 4th Generation Intel® Core™ i3 Processors | Bristol Ridge |
| Status | Launched | |
| Vertical segment | Embedded | Laptop |
Performance |
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| 64 bit support | ||
| Base frequency | 2.40 GHz | |
| Bus Speed | 5 GT/s DMI2 | |
| Manufacturing process technology | 22 nm | 28 nm |
| Maximum core temperature | 72°C | 90 °C |
| Number of cores | 2 | 2 |
| Number of threads | 4 | 2 |
| Die size | 124.5 mm | |
| Maximum frequency | 2.2 GHz | |
| Transistor count | 1200 Million | |
Memory |
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| Max memory channels | 2 | |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 32 GB | |
| Supported memory types | DDR3 1333/1600 | |
Graphics |
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| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.00 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 1.7 GB | |
| Processor graphics | Intel® HD Graphics 4600 | |
Graphics interfaces |
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| Number of displays supported | 3 | |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | |
| Package Size | 37.5mm x 37.5mm | |
| Sockets supported | FCLGA1150 | |
| Thermal Design Power (TDP) | 35 Watt | 10 Watt |
| Thermal Solution | PCG 2013A | |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | Up to 1x16, 2x8, 1x8/2x4 | |
| Scalability | 1S Only | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||