Intel Core i3-4330TE vs Intel Core i7-2715QE
Comparative analysis of Intel Core i3-4330TE and Intel Core i7-2715QE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i3-4330TE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 93% higher maximum memory size: 32 GB vs 16.6 GB
- Around 29% lower typical power consumption: 35 Watt vs 45 Watt
- Around 3% better performance in PassMark - Single thread mark: 1327 vs 1287
| Specifications (specs) | |
| Manufacturing process technology | 22 nm vs 32 nm |
| Maximum memory size | 32 GB vs 16.6 GB |
| Thermal Design Power (TDP) | 35 Watt vs 45 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 1327 vs 1287 |
Reasons to consider the Intel Core i7-2715QE
- 2 more cores, run more applications at once: 4 vs 2
- 4 more threads: 8 vs 4
- Around 39% higher maximum core temperature: 100 C vs 72°C
- Around 59% better performance in PassMark - CPU mark: 3221 vs 2022
| Specifications (specs) | |
| Number of cores | 4 vs 2 |
| Number of threads | 8 vs 4 |
| Maximum core temperature | 100 C vs 72°C |
| Benchmarks | |
| PassMark - CPU mark | 3221 vs 2022 |
Compare benchmarks
CPU 1: Intel Core i3-4330TE
CPU 2: Intel Core i7-2715QE
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i3-4330TE | Intel Core i7-2715QE |
|---|---|---|
| PassMark - Single thread mark | 1327 | 1287 |
| PassMark - CPU mark | 2022 | 3221 |
Compare specifications (specs)
| Intel Core i3-4330TE | Intel Core i7-2715QE | |
|---|---|---|
Essentials |
||
| Architecture codename | Haswell | Sandy Bridge |
| Launch date | Q3'13 | January 2011 |
| Place in performance rating | 1904 | 1907 |
| Processor Number | i3-4330TE | i7-2715QE |
| Series | 4th Generation Intel® Core™ i3 Processors | Legacy Intel® Core™ Processors |
| Status | Launched | Launched |
| Vertical segment | Embedded | Embedded |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.40 GHz | 2.10 GHz |
| Bus Speed | 5 GT/s DMI2 | 5 GT/s DMI |
| Manufacturing process technology | 22 nm | 32 nm |
| Maximum core temperature | 72°C | 100 C |
| Number of cores | 2 | 4 |
| Number of threads | 4 | 8 |
| Die size | 216 mm | |
| L1 cache | 64 KB (per core) | |
| L2 cache | 256 KB (per core) | |
| L3 cache | 6144 KB (shared) | |
| Maximum frequency | 3.00 GHz | |
| Transistor count | 1160 million | |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 32 GB | 16.6 GB |
| Supported memory types | DDR3 1333/1600 | DDR3 1066/1333/1600 |
| ECC memory support | ||
Graphics |
||
| Graphics base frequency | 350 MHz | 650 MHz |
| Graphics max dynamic frequency | 1.00 GHz | 1.20 GHz |
| Intel® Clear Video HD technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 1.7 GB | |
| Processor graphics | Intel® HD Graphics 4600 | Intel® HD Graphics 3000 |
| Graphics max frequency | 1.2 GHz | |
| Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
||
| Number of displays supported | 3 | 2 |
| CRT | ||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| SDVO | ||
| Wireless Display (WiDi) support | ||
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | 31mm x 24mm (FCBGA1023) |
| Sockets supported | FCLGA1150 | FCBGA1023 |
| Thermal Design Power (TDP) | 35 Watt | 45 Watt |
| Thermal Solution | PCG 2013A | |
Peripherals |
||
| Max number of PCIe lanes | 16 | 16 |
| PCI Express revision | 3.0 | 2.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8/2x4 | 1x16, 2x8, 1x8+2x4 |
| Scalability | 1S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Intel® Identity Protection technology | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | Intel® AVX |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
| Flexible Display interface (FDI) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Demand Based Switching | ||
| Intel® Fast Memory Access | ||
| Intel® Flex Memory Access | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
