Intel Core i3-4350 vs AMD Phenom II X3 B75
Comparative analysis of Intel Core i3-4350 and AMD Phenom II X3 B75 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Core i3-4350
- CPU is newer: launch date 4 year(s) 7 month(s) later
- 1 more threads: 4 vs 3
- Around 20% higher clock speed: 3.6 GHz vs 3 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 76% lower typical power consumption: 54 Watt vs 95 Watt
- Around 57% better performance in PassMark - Single thread mark: 1973 vs 1256
- Around 99% better performance in PassMark - CPU mark: 3548 vs 1781
- 2.1x better performance in Geekbench 4 - Single Core: 3940 vs 1905
- Around 64% better performance in Geekbench 4 - Multi-Core: 7274 vs 4439
Specifications (specs) | |
Launch date | May 2014 vs October 2009 |
Number of threads | 4 vs 3 |
Maximum frequency | 3.6 GHz vs 3 GHz |
Manufacturing process technology | 22 nm vs 45 nm |
Thermal Design Power (TDP) | 54 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 1973 vs 1256 |
PassMark - CPU mark | 3548 vs 1781 |
Geekbench 4 - Single Core | 3940 vs 1905 |
Geekbench 4 - Multi-Core | 7274 vs 4439 |
Reasons to consider the AMD Phenom II X3 B75
- 1 more cores, run more applications at once: 3 vs 2
- 3x more L1 cache, more data can be stored in the L1 cache for quick access later
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
Number of cores | 3 vs 2 |
L1 cache | 128 KB (per core) vs 64 KB (per core) |
L2 cache | 512 KB (per core) vs 256 KB (per core) |
L3 cache | 6144 KB (shared) vs 4096 KB (shared) |
Compare benchmarks
CPU 1: Intel Core i3-4350
CPU 2: AMD Phenom II X3 B75
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i3-4350 | AMD Phenom II X3 B75 |
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PassMark - Single thread mark | 1973 | 1256 |
PassMark - CPU mark | 3548 | 1781 |
Geekbench 4 - Single Core | 3940 | 1905 |
Geekbench 4 - Multi-Core | 7274 | 4439 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 18.636 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 50.976 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.321 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.246 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 3.059 |
Compare specifications (specs)
Intel Core i3-4350 | AMD Phenom II X3 B75 | |
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Essentials |
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Architecture codename | Haswell | Heka |
Launch date | May 2014 | October 2009 |
Launch price (MSRP) | $170 | |
Place in performance rating | 1462 | 1503 |
Price now | $168.99 | $39.99 |
Processor Number | i3-4350 | |
Series | 4th Generation Intel® Core™ i3 Processors | AMD Business Class - AMD Phenom X3 Triple-Core |
Status | Discontinued | |
Value for money (0-100) | 8.65 | 21.61 |
Vertical segment | Desktop | Desktop |
Family | AMD Phenom | |
OPN Tray | HDXB75WFK3DGM | |
Performance |
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64 bit support | ||
Base frequency | 3.60 GHz | 3 GHz |
Bus Speed | 5 GT/s DMI2 | |
Die size | 177 mm | 258 mm |
L1 cache | 64 KB (per core) | 128 KB (per core) |
L2 cache | 256 KB (per core) | 512 KB (per core) |
L3 cache | 4096 KB (shared) | 6144 KB (shared) |
Manufacturing process technology | 22 nm | 45 nm |
Maximum case temperature (TCase) | 72 °C | |
Maximum core temperature | 72°C | |
Maximum frequency | 3.6 GHz | 3 GHz |
Number of cores | 2 | 3 |
Number of threads | 4 | 3 |
Transistor count | 1400 million | 758 million |
Unlocked | ||
Memory |
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ECC memory support | ||
Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V | DDR3 |
Graphics |
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Device ID | 0x412 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.15 GHz | |
Graphics max frequency | 1.15 GHz | |
Intel® Clear Video HD technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® HD Graphics 4600 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over eDP | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
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DirectX | 11.1/12 | |
OpenGL | 4.3 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1150 | AM3 |
Thermal Design Power (TDP) | 54 Watt | 95 Watt |
Thermal Solution | PCG 2013C | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | Up to 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |