Intel Core i3-4350 vs AMD Phenom II X3 B75

Comparative analysis of Intel Core i3-4350 and AMD Phenom II X3 B75 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Core i3-4350

  • CPU is newer: launch date 4 year(s) 7 month(s) later
  • 1 more threads: 4 vs 3
  • Around 20% higher clock speed: 3.6 GHz vs 3 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
  • Around 76% lower typical power consumption: 54 Watt vs 95 Watt
  • Around 57% better performance in PassMark - Single thread mark: 1973 vs 1256
  • Around 99% better performance in PassMark - CPU mark: 3548 vs 1781
  • 2.1x better performance in Geekbench 4 - Single Core: 3940 vs 1905
  • Around 64% better performance in Geekbench 4 - Multi-Core: 7274 vs 4439
Specifications (specs)
Launch date May 2014 vs October 2009
Number of threads 4 vs 3
Maximum frequency 3.6 GHz vs 3 GHz
Manufacturing process technology 22 nm vs 45 nm
Thermal Design Power (TDP) 54 Watt vs 95 Watt
Benchmarks
PassMark - Single thread mark 1973 vs 1256
PassMark - CPU mark 3548 vs 1781
Geekbench 4 - Single Core 3940 vs 1905
Geekbench 4 - Multi-Core 7274 vs 4439

Reasons to consider the AMD Phenom II X3 B75

  • 1 more cores, run more applications at once: 3 vs 2
  • 3x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 3x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
Number of cores 3 vs 2
L1 cache 128 KB (per core) vs 64 KB (per core)
L2 cache 512 KB (per core) vs 256 KB (per core)
L3 cache 6144 KB (shared) vs 4096 KB (shared)

Compare benchmarks

CPU 1: Intel Core i3-4350
CPU 2: AMD Phenom II X3 B75

PassMark - Single thread mark
CPU 1
CPU 2
1973
1256
PassMark - CPU mark
CPU 1
CPU 2
3548
1781
Geekbench 4 - Single Core
CPU 1
CPU 2
3940
1905
Geekbench 4 - Multi-Core
CPU 1
CPU 2
7274
4439
Name Intel Core i3-4350 AMD Phenom II X3 B75
PassMark - Single thread mark 1973 1256
PassMark - CPU mark 3548 1781
Geekbench 4 - Single Core 3940 1905
Geekbench 4 - Multi-Core 7274 4439
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 18.636
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 50.976
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.321
CompuBench 1.5 Desktop - Video Composition (Frames/s) 1.246
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 3.059

Compare specifications (specs)

Intel Core i3-4350 AMD Phenom II X3 B75

Essentials

Architecture codename Haswell Heka
Launch date May 2014 October 2009
Launch price (MSRP) $170
Place in performance rating 1462 1502
Price now $168.99 $39.99
Processor Number i3-4350
Series 4th Generation Intel® Core™ i3 Processors AMD Business Class - AMD Phenom X3 Triple-Core
Status Discontinued
Value for money (0-100) 8.65 21.61
Vertical segment Desktop Desktop
Family AMD Phenom
OPN Tray HDXB75WFK3DGM

Performance

64 bit support
Base frequency 3.60 GHz 3 GHz
Bus Speed 5 GT/s DMI2
Die size 177 mm 258 mm
L1 cache 64 KB (per core) 128 KB (per core)
L2 cache 256 KB (per core) 512 KB (per core)
L3 cache 4096 KB (shared) 6144 KB (shared)
Manufacturing process technology 22 nm 45 nm
Maximum case temperature (TCase) 72 °C
Maximum core temperature 72°C
Maximum frequency 3.6 GHz 3 GHz
Number of cores 2 3
Number of threads 4 3
Transistor count 1400 million 758 million
Unlocked

Memory

ECC memory support
Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V DDR3

Graphics

Device ID 0x412
Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.15 GHz
Graphics max frequency 1.15 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 2 GB
Processor graphics Intel® HD Graphics 4600

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3
VGA
Wireless Display (WiDi) support

Graphics image quality

Max resolution over DisplayPort 3840x2160@60Hz
Max resolution over eDP 3840x2160@60Hz
Max resolution over HDMI 1.4 4096x2304@24Hz
Max resolution over VGA 1920x1200@60Hz

Graphics API support

DirectX 11.1/12
OpenGL 4.3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1150 AM3
Thermal Design Power (TDP) 54 Watt 95 Watt
Thermal Solution PCG 2013C

Peripherals

Max number of PCIe lanes 16
PCI Express revision Up to 3.0
PCIe configurations Up to 1x16, 2x8, 1x8+2x4
Scalability 1S Only

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)