Intel Core i3-N300 vs Intel Core i5-4202Y
Comparative analysis of Intel Core i3-N300 and Intel Core i5-4202Y processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-N300
- CPU is newer: launch date 9 year(s) 4 month(s) later
- 6 more cores, run more applications at once: 8 vs 2
- 4 more threads: 8 vs 4
- Around 85% higher clock speed: 3.7 GHz vs 2.00 GHz
- Around 5% higher maximum core temperature: 105°C vs 100°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 22 nm
- 6x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 71% lower typical power consumption: 7 Watt vs 11.5 Watt
- 2.1x better performance in PassMark - Single thread mark: 2072 vs 964
- 5.7x better performance in PassMark - CPU mark: 8592 vs 1518
| Specifications (specs) | |
| Launch date | 3 Jan 2023 vs 1 September 2013 |
| Number of cores | 8 vs 2 |
| Number of threads | 8 vs 4 |
| Maximum frequency | 3.7 GHz vs 2.00 GHz |
| Maximum core temperature | 105°C vs 100°C |
| Manufacturing process technology | 10 nm vs 22 nm |
| L1 cache | 96K (per core) vs 128 KB |
| Thermal Design Power (TDP) | 7 Watt vs 11.5 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2072 vs 964 |
| PassMark - CPU mark | 8592 vs 1518 |
Reasons to consider the Intel Core i5-4202Y
- 262144x more L2 cache, more data can be stored in the L2 cache for quick access later
- 524288x more L3 cache, more data can be stored in the L3 cache for quick access later
| L2 cache | 512 KB vs 2MB (per module) |
| L3 cache | 3 MB vs 6MB (shared) |
Compare benchmarks
CPU 1: Intel Core i3-N300
CPU 2: Intel Core i5-4202Y
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Name | Intel Core i3-N300 | Intel Core i5-4202Y |
|---|---|---|
| PassMark - Single thread mark | 2072 | 964 |
| PassMark - CPU mark | 8592 | 1518 |
| Geekbench 4 - Single Core | 421 | |
| Geekbench 4 - Multi-Core | 787 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 6054 | |
| GFXBench 4.0 - Manhattan (Frames) | 1504 | |
| GFXBench 4.0 - T-Rex (Frames) | 2298 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 6054 | |
| GFXBench 4.0 - Manhattan (Fps) | 1504 | |
| GFXBench 4.0 - T-Rex (Fps) | 2298 |
Compare specifications (specs)
| Intel Core i3-N300 | Intel Core i5-4202Y | |
|---|---|---|
Essentials |
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| Launch date | 3 Jan 2023 | 1 September 2013 |
| Launch price (MSRP) | $309 | |
| Place in performance rating | 1182 | 1157 |
| Architecture codename | Haswell | |
| Processor Number | i5-4202Y | |
| Series | 4th Generation Intel® Core™ i5 Processors | |
| Status | Launched | |
| Vertical segment | Mobile | |
Performance |
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| Base frequency | 100 MHz | 1.60 GHz |
| L1 cache | 96K (per core) | 128 KB |
| L2 cache | 2MB (per module) | 512 KB |
| L3 cache | 6MB (shared) | 3 MB |
| Manufacturing process technology | 10 nm | 22 nm |
| Maximum core temperature | 105°C | 100°C |
| Maximum frequency | 3.7 GHz | 2.00 GHz |
| Number of cores | 8 | 2 |
| Number of threads | 8 | 4 |
| Unlocked | ||
| 64 bit support | ||
| Bus Speed | 5 GT/s DMI2 | |
Memory |
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| ECC memory support | ||
| Supported memory types | DDR4, DDR5, 4800 MHz, Single-channel | DDR3L 1333/1600, LPDDR3 1333/1600 |
| Max memory channels | 2 | |
| Maximum memory bandwidth | 25.6 GB/s | |
| Maximum memory size | 16 GB | |
Compatibility |
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| Max number of CPUs in a configuration | 1 | 1 |
| Sockets supported | Intel BGA 1264 | FCBGA1168 |
| Thermal Design Power (TDP) | 7 Watt | 11.5 Watt |
| Low Halogen Options Available | ||
| Package Size | 40mm x 24mm x 1.5mm | |
| Scenario Design Power (SDP) | 4.5 W | |
Peripherals |
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| PCIe configurations | Gen 3, 9 Lanes, (CPU only) | 4x1, 2x4 |
| Integrated IDE | ||
| Integrated LAN | ||
| Max number of PCIe lanes | 12 | |
| Max number of SATA 6 Gb/s Ports | 4 | |
| Number of USB ports | 4 | |
| PCI Express revision | 2.0 | |
| PCI support | ||
| Total number of SATA ports | 4 | |
| UART | ||
| USB revision | 3.0 | |
Graphics |
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| Device ID | 0x402 | |
| Graphics base frequency | 200 MHz | |
| Graphics max dynamic frequency | 850 MHz | |
| Graphics max frequency | 850 MHz | |
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 2 GB | |
| Processor graphics | Intel® HD Graphics 4200 | |
Graphics interfaces |
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| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
| Wireless Display (WiDi) support | ||
Graphics image quality |
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| Max resolution over DisplayPort | 2560x1600@60Hz | |
| Max resolution over HDMI 1.4 | 2560x1600@60Hz | |
Graphics API support |
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| DirectX | 11.2/12 | |
| OpenGL | 4.3 | |
Security & Reliability |
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| Anti-Theft technology | ||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Flexible Display interface (FDI) | ||
| General-Purpose Input/Output (GPIO) | ||
| HD Audio | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
| Intel 64 | ||
| Intel® Active Management technology (AMT) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® ME Firmware Version | 9.5 | |
| Intel® Rapid Storage technology (RST) | ||
| Intel® Smart Response technology | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Matrix Storage | ||
| Smart Connect | ||
| Thermal Monitoring | ||
Virtualization |
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| AMD Virtualization (AMD-V™) | ||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
