Intel Core i5-750s vs Intel Core 2 Extreme QX9650

Comparative analysis of Intel Core i5-750s and Intel Core 2 Extreme QX9650 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.

Intel Core i5-750s

Intel Core 2 Extreme QX9650

Differences

Reasons to consider the Intel Core i5-750s

CPU is newer: launch date 2 year(s) 2 month(s) later
Around 7% higher clock speed: 3.20 GHz vs 3 GHz
Around 19% higher maximum core temperature: 76.7°C vs 64.5°C
Around 59% lower typical power consumption: 82 Watt vs 130 Watt

Launch date	January 2010 vs November 2007
Maximum frequency	3.20 GHz vs 3 GHz
Maximum core temperature	76.7°C vs 64.5°C
Thermal Design Power (TDP)	82 Watt vs 130 Watt

Reasons to consider the Intel Core 2 Extreme QX9650

Processor is unlocked, an unlocked multiplier allows for easier overclocking
12x more L2 cache, more data can be stored in the L2 cache for quick access later

Unlocked	Unlocked vs Locked
L2 cache	12288 KB vs 256 KB (per core)

Compare benchmarks

CPU 1: Intel Core i5-750s
CPU 2: Intel Core 2 Extreme QX9650

Name	Intel Core i5-750s	Intel Core 2 Extreme QX9650
PassMark - Single thread mark	987
PassMark - CPU mark	2197
Geekbench 4 - Single Core		465
Geekbench 4 - Multi-Core		1463
3DMark Fire Strike - Physics Score		4864

Compare specifications (specs)

	Intel Core i5-750s	Intel Core 2 Extreme QX9650
Essentials
Architecture codename	Lynnfield	Yorkfield
Launch date	January 2010	November 2007
Place in performance rating	2281	2283
Processor Number	i5-750S	QX9650
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.40 GHz	3.00 GHz
Bus Speed	2.5 GT/s DMI	1333 MHz FSB
Die size	296 mm2	214 mm2
L1 cache	64 KB (per core)	256 KB
L2 cache	256 KB (per core)	12288 KB
L3 cache	8192 KB (shared)
Manufacturing process technology	45 nm	45 nm
Maximum core temperature	76.7°C	64.5°C
Maximum frequency	3.20 GHz	3 GHz
Number of cores	4	4
Number of threads	4
Transistor count	774 million	820 million
VID voltage range	0.6500V-1.4000V	0.8500V-1.3625V
Maximum case temperature (TCase)		64 °C
Unlocked
Memory
Max memory channels	2
Maximum memory bandwidth	21 GB/s
Maximum memory size	16 GB
Supported memory types	DDR3 1066/1333	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	LGA1156	LGA775
Thermal Design Power (TDP)	82 Watt	130 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	36-bit
Thermal Monitoring
FSB parity
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® VT-x with Extended Page Tables (EPT)