Intel Core i7-2655LE vs AMD Phenom II X3 N870

Comparative analysis of Intel Core i7-2655LE and AMD Phenom II X3 N870 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core i7-2655LE

AMD Phenom II X3 N870

Differences

Reasons to consider the Intel Core i7-2655LE

1 more threads: 4 vs 3
Around 26% higher clock speed: 2.90 GHz vs 2.3 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
Around 40% lower typical power consumption: 25 Watt vs 35 Watt
Around 37% better performance in PassMark - Single thread mark: 1231 vs 900
Around 51% better performance in PassMark - CPU mark: 1999 vs 1324

Specifications (specs)
Number of threads	4 vs 3
Maximum frequency	2.90 GHz vs 2.3 GHz
Manufacturing process technology	32 nm vs 45 nm
Thermal Design Power (TDP)	25 Watt vs 35 Watt
Benchmarks
PassMark - Single thread mark	1231 vs 900
PassMark - CPU mark	1999 vs 1324

Reasons to consider the AMD Phenom II X3 N870

1 more cores, run more applications at once: 3 vs 2

Number of cores	3 vs 2

Compare benchmarks

CPU 1: Intel Core i7-2655LE
CPU 2: AMD Phenom II X3 N870

PassMark - Single thread mark

CPU 1

CPU 2

1231

900

PassMark - CPU mark

CPU 1

CPU 2

1999

1324

Name	Intel Core i7-2655LE	AMD Phenom II X3 N870
PassMark - Single thread mark	1231	900
PassMark - CPU mark	1999	1324
Geekbench 4 - Single Core		1396
Geekbench 4 - Multi-Core		3154

Compare specifications (specs)

	Intel Core i7-2655LE	AMD Phenom II X3 N870
Essentials
Architecture codename	Sandy Bridge	Champlain
Launch date	Q1'11	16 December 2010
Place in performance rating	1997	1972
Processor Number	i7-2655LE
Series	Legacy Intel® Core™ Processors	AMD Phenom II Triple-Core Mobile Processors
Status	Launched
Vertical segment	Embedded	Laptop
Family		AMD Phenom
OPN Tray		HMN870DCR32GM
Performance
64 bit support
Base frequency	2.20 GHz	2.3 GHz
Bus Speed	5 GT/s DMI
Manufacturing process technology	32 nm	45 nm
Maximum core temperature	100 C	100°C
Maximum frequency	2.90 GHz	2.3 GHz
Number of cores	2	3
Number of threads	4	3
Front-side bus (FSB)		3600 MHz
L1 cache		384 KB
L2 cache		1.5 MB
Unlocked
Memory
Max memory channels	2
Maximum memory size	16.6 GB
Supported memory types	DDR3 1066/1333	DDR3
Graphics
Graphics base frequency	650 MHz
Graphics max dynamic frequency	1.00 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel® HD Graphics 3000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Compatibility
Low Halogen Options Available
Package Size	31mm x 24mm (FCBGA1023)
Sockets supported	FCBGA1023	AM2+
Thermal Design Power (TDP)	25 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8+2x4
Security & Reliability
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)