Intel Core m3-8114Y vs Intel Xeon E-2124

Comparative analysis of Intel Core m3-8114Y and Intel Xeon E-2124 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Core m3-8114Y

Intel Xeon E-2124

Differences

Reasons to consider the Intel Core m3-8114Y

A newer manufacturing process allows for a more powerful, yet cooler running processor: 10 nm vs 14 nm
2.5x lower typical power consumption: 28 Watt vs 71 Watt

Manufacturing process technology	10 nm vs 14 nm
Thermal Design Power (TDP)	28 Watt vs 71 Watt

Reasons to consider the Intel Xeon E-2124

2 more cores, run more applications at once: 4 vs 2
Around 187% higher clock speed: 4.30 GHz vs 1.5 GHz
2x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
2x more L3 cache, more data can be stored in the L3 cache for quick access later

Number of cores	4 vs 2
Maximum frequency	4.30 GHz vs 1.5 GHz
L1 cache	64K (per core) vs 64 KB (per core)
L2 cache	256K (per core) vs 256 KB (per core)
L3 cache	8 MB (shared) vs 4096 KB (shared)

Compare benchmarks

CPU 1: Intel Core m3-8114Y
CPU 2: Intel Xeon E-2124

Name	Intel Core m3-8114Y	Intel Xeon E-2124
PassMark - Single thread mark		2501
PassMark - CPU mark		6927

Compare specifications (specs)

	Intel Core m3-8114Y	Intel Xeon E-2124
Essentials
Architecture codename	Coffee Lake-U	Coffee Lake
Launch date	May 2018	May 2018
Place in performance rating	not rated	980
Vertical segment	Laptop	Server
Processor Number		E-2124
Series		Intel® Xeon® E Processor
Status		Launched
Performance
64 bit support
Die size	123 mm	126 mm
L1 cache	64 KB (per core)	64K (per core)
L2 cache	256 KB (per core)	256K (per core)
L3 cache	4096 KB (shared)	8 MB (shared)
Manufacturing process technology	10 nm	14 nm
Maximum case temperature (TCase)	72 °C
Maximum frequency	1.5 GHz	4.30 GHz
Number of cores	2	4
Base frequency		3.30 GHz
Bus Speed		8 GT/s DMI3
Number of threads		4
Transistor count		1400 million
Memory
Supported memory types	DDR4	DDR4-2666
Max memory channels		2
Maximum memory bandwidth		41.6 GB/s
Maximum memory size		128 GB
Compatibility
Max number of CPUs in a configuration	1	1
Thermal Design Power (TDP)	28 Watt	71 Watt
Low Halogen Options Available
Package Size		37.5mm x 37.5mm
Sockets supported		FCLGA1151
Security & Reliability
Intel® Trusted Execution technology (TXT)
Execute Disable Bit (EDB)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Secure Key technology
Intel® Software Guard Extensions (Intel® SGX)
Secure Boot
Advanced Technologies
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions		Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Peripherals
Max number of PCIe lanes		16
PCI Express revision		3.0
PCIe configurations		1x16,2x8,1x8+2x4
Scalability		1S Only